Patents by Inventor Dominic Wayda

Dominic Wayda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reprocessing of page strips responsive to low memory condition
    Patent number: 11113012
    Abstract: Strips of a page are processed according to a rendering technique, compressed, and stored in a memory buffer until a low memory condition of the buffer occurs. When the low memory condition occurs, the strips that are already stored in the buffer are decompressed, processed according to a memory utilization reduction technique, compressed, and stored in the memory buffer. Strips that are not yet already stored in the buffer when the low memory condition occurs are processed according to the rendering technique and then according to the memory utilization reduction technique before being compressed and stored in the memory buffer.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark Shaw, Kurt Robert Bengston, Dominic Wayda
  • REPROCESSING OF PAGE STRIPS RESPONSIVE TO LOW MEMORY CONDITION
    Publication number: 20210132871
    Abstract: Strips of a page are processed according to a rendering technique, compressed, and stored in a memory buffer until a low memory condition of the buffer occurs. When the low memory condition occurs, the strips that are already stored in the buffer are decompressed, processed according to a memory utilization reduction technique, compressed, and stored in the memory buffer. Strips that are not yet already stored in the buffer when the low memory condition occurs are processed according to the rendering technique and then according to the memory utilization reduction technique before being compressed and stored in the memory buffer.
    Type: Application
    Filed: March 28, 2018
    Publication date: May 6, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Mark Shaw, Kurt Robert Bengston, Dominic Wayda