Patents by Inventor Dominick J. Frustaci

Dominick J. Frustaci has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200054881
    Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 20, 2020
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Patent number: 10500402
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: December 10, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 10449375
    Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: October 22, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Publication number: 20180178016
    Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
    Type: Application
    Filed: December 18, 2017
    Publication date: June 28, 2018
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Publication number: 20180178017
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Application
    Filed: February 12, 2018
    Publication date: June 28, 2018
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9889306
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: July 11, 2015
    Date of Patent: February 13, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9687662
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: July 11, 2015
    Date of Patent: June 27, 2017
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9511220
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: December 6, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Bruehl E. Truex, Donald H. Hickel, Jr.
  • Patent number: 9504843
    Abstract: An implantable cardioverter defibrillator (ICD) includes a communication interface operable to receive a communication signal from an external programmer. With the ICD not being in the presence of an MRI field generated by an MRI scanner, a communication signal is sent precharging a high energy storage capacitor before the patient undergoes the MRI scan. The signal also switches the ICD into an MRI mode which turns off the ICD's sensing functions detecting a dangerous ventricular arrhythmia. An operator monitors the patient's vital signs with sensors connected to the patient. If the patient does require the defibrillation shock, the operator sends a second communication signal delivering the defibrillation shock from the precharged high energy storage capacitor of the ICD. The patient can then be removed from the MRI scanner and the RF and gradient fields of the MRI scanner turned off.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: November 29, 2016
    Assignee: Greatbach Ltd.
    Inventors: Dominick J. Frustaci, Robert A. Stevenson, Barry C. Muffoletto
  • Patent number: 9492659
    Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: November 15, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Robert A. Stevenson, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9352150
    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: May 31, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Steven W. Winn, Christine A. Frysz, Richard L. Brendel, Jason Woods, Dominick J. Frustaci, Xiaohong Tang, William C. Thiebolt
  • Publication number: 20160008595
    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
    Type: Application
    Filed: September 25, 2015
    Publication date: January 14, 2016
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Steven W. Winn, Christine A. Frysz, Richard L. Brendel, Jason Woods, Dominick J. Frustaci, Xiaohong Tang, William C. Thiebolt
  • Patent number: 9233253
    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: January 12, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Steven W. Winn, Christine A. Frysz, Richard L. Brendel, Jason Woods, Dominick J. Frustaci, Xiaohong Tang, William C. Thiebolt
  • Publication number: 20150314131
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Application
    Filed: July 11, 2015
    Publication date: November 5, 2015
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Publication number: 20150314132
    Abstract: An implantable cardioverter defibrillator (ICD) includes a communication interface operable to receive a communication signal from an external programmer. With the ICD not being in the presence of an MRI field generated by an MRI scanner, a communication signal is sent precharging a high energy storage capacitor before the patient undergoes the MRI scan. The signal also switches the ICD into an MRI mode which turns off the ICD's sensing functions detecting a dangerous ventricular arrhythmia. An operator monitors the patient's vital signs with sensors connected to the patient. If the patient does require the defibrillation shock, the operator sends a second communication signal delivering the defibrillation shock from the precharged high energy storage capacitor of the ICD. The patient can then be removed from the MRI scanner and the RF and gradient fields of the MRI scanner turned off.
    Type: Application
    Filed: July 10, 2015
    Publication date: November 5, 2015
    Inventors: Dominick J. Frustaci, Robert A. Stevenson, Barry C. Muffoletto
  • Patent number: 9101782
    Abstract: An implantable cardioverter defibrillator includes a communication interface operable to receive a communication signal from an external programmer. The communication signal includes a command to switch the ICD from a first mode to a second mode. A processor is in electrical communication with the communication interface and configured to switch the ICD between the first and second modes. A battery is configured to supply low DC voltage. A converter is configured to convert the low DC voltage to a high DC voltage. An energy storage capacitor is electrically coupled to the converter and configured to store a therapeutic energy or high DC voltage including at least 15 joules. The second mode includes activating the converter to convert the low DC voltage to the high DC voltage and storing the therapeutic energy or at least 15 joules within the energy storage capacitor during a period of time of the second mode.
    Type: Grant
    Filed: August 4, 2013
    Date of Patent: August 11, 2015
    Assignee: Greatbatch Ltd.
    Inventors: Dominick J. Frustaci, Barry C. Muffoletto, Robert A. Stevenson
  • Publication number: 20150207484
    Abstract: A composite RF current attenuator for a medical lead includes a conductor having a distal electrode contactable to biological cells, a bandstop filter in series with the lead conductor for attenuating RF currents flow through the lead conductor at a selected center frequency or across a range of frequencies about the center frequency, and a lowpass filter in series with the bandstop filter and forming a portion of the lead conductor. The bandstop filter has a capacitance in parallel with a first inductance. In a preferred form, the lowpass filter includes a second inductance in series with the bandstop filter, wherein the values of capacitance and inductances for the composite RF current attenuator are selected such that it attenuates MRI-induced RF current flow in an MRI environment.
    Type: Application
    Filed: March 26, 2015
    Publication date: July 23, 2015
    Inventors: Robert A. Stevenson, Robert Shawn Johnson, Kishore Kumar Kondabatni, Joseph E. Spaulding, Dominick J. Frustaci, Warren S. Dabney, Holly Noelle Moschiano
  • Patent number: 9071221
    Abstract: A composite RF current attenuator for a medical lead includes a conductor having a distal electrode contactable to biological cells, a bandstop filter in series with the lead conductor for attenuating RF currents flow through the lead conductor at a selected center frequency or across a range of frequencies about the center frequency, and a lowpass filter in series with the bandstop filter and forming a portion of the lead conductor. The bandstop filter has a capacitance in parallel with a first inductance. In a preferred form, the lowpass filter includes a second inductance in series with the bandstop filter, wherein the values of capacitance and inductances for the composite RF current attenuator are selected such that it attenuates MRI-induced RF current flow in an MRI environment.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: June 30, 2015
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Robert Shawn Johnson, Kishore Kumar Kondabatni, Joseph E. Spaulding, Dominick J. Frustaci, Warren S. Dabney, Holly Noelle Moschiano
  • Publication number: 20150134039
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 14, 2015
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Bruehl E. Truex, Donald H. Hickel, JR.
  • Patent number: 9014808
    Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
    Type: Grant
    Filed: February 23, 2014
    Date of Patent: April 21, 2015
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel, Robert S. Johnson, Dominick J. Frustaci, Warren S. Dabney, Keith W. Seitz, Thomas Marzano, John E. Roberts, William C. Thiebolt, Christopher M. Williams, Buehl E. Truex