Abstract: A state-detection circuit facilitates the detection of the state of an input pin relative to several different types of input circuits. According to an example embodiment, a state-detection circuit includes a plurality of comparators and circuit components, configured to provide a plurality of binary output signals that collectively indicate a state of an input pin to which the comparators are coupled. The state-detection circuit is configured to facilitate the detection of several different types of input circuits, based upon the binary output signals.

Abstract: A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips.

Abstract: A state-detection circuit facilitates the detection of the state of an input pin relative to several different types of input circuits. According to an example embodiment, a state-detection circuit includes a plurality of comparators and circuit components, configured to provide a plurality of binary output signals that collectively indicate a state of an input pin to which the comparators are coupled. The state-detection circuit is configured to facilitate the detection of several different types of input circuits, based upon the binary output signals.

Abstract: A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips.

Abstract: The invention implements a Positive Emitter Coupled Logic (PECL) output using CMOS transistors that approximate the Motorola ECL characteristics into standard PECL termination schemes. By creating a PECL output using a switchable current source the PECL output can be integrated into a Low Voltage Differential Signaling (LVDS) structure. The invention allows the user to switch between PECL and LVDS outputs via control logic by enabling the specific circuit elements for each signaling technology. With this invention, the combination of two drivers on one IC device gives system designers the flexibility to use the same circuitry in two separate signaling schemes. Thus, the designers can select to use one output characteristics or the other for their designs.

Abstract: The invention implements a Positive Emitter Coupled Logic (PECL) output using CMOS transistors that approximate the Motorola ECL characteristics into standard PECL termination schemes. By creating a PECL output using a switchable current source the PECL output can be integrated into a Low Voltage Differential Signaling (LVDS) structure. The invention allows the user to switch between PECL and LVDS outputs via control logic by enabling the specific circuit elements for each signaling technology. With this invention, the combination of two drivers on one IC device gives system designers the flexibility to use the same circuitry in two separate signaling schemes. Thus, the designers can select to use one output characteristics or the other for their designs.