Abstract: The invention relates to a method for switching a particulate material flow in the construction of models in layers, wherein particulate materials are fed to a subsequent method step from a container having an opening in the direction of a workpiece platform. The particles in the container are exposed to a vacuum and to overpressure.

Abstract: The invention relates to a device for producing three-dimensional models, comprising a coater, which includes an ejection opening, at least one print head, which is mounted on a print axis, the ejection opening of the coater being disposed toward the top in the coating direction, and the print head being disposed counter to the coating direction with the opposite orientation on the printing axis behind the coater in the coating direction; the invention also relates to a method for producing three-dimensional models.

Abstract: The present invention relates to a device for producing three-dimensional models by a layering technique, at least one print head (8) being provided for selective dispensing of at least one material onto a target surface in the form of droplets. The print head (8) is in engagement with a receptacle at two points spaced a distance apart, the position and alignment of the print head (8) relative to the target surface is steplessly adjustable in all spatial directions via these two points, and the receptacle and the target surface are movable in relation to each other.

Abstract: The invention relates to a device for producing three-dimensional models in a continuous process, comprising a build surface which has a first end in the direction of movement and a second end in the direction of movement, at least one dosing device and at least one solidification unit, characterized in that the build surface is designed to transport heavy components, and the components are transportable over the build surface essentially without distortion, and also comprising a method therefor.

Abstract: A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.

Abstract: The invention relates to a device (1) for building a layer body (2) from a plurality of superimposed layers of free-flowing material, in particular particulate material, on a building platform (3) in a build space (4), the layers being solidified and joined to each other in locally predetermined areas, so that at least one layer body (2) is formed by the solidified and joined areas of the layers, including an elongated discharge container (5), which is movable back and forth over the build space (11 [sic; 4]) in at least one discharge direction and which has at least one discharge opening (6) from which the free-flowing material is dischargeable in individual superimposed layers during the movement of the discharge container (5), it being possible to supply the discharge container (5) with free-flowing material from a filling device with at least one storage or filling container (10) having at least one outflow opening (11) by vertically covering the at least one outflow opening (11) of the storage or filling

Abstract: The present invention relates to a device for producing three-dimensional models by a layering technique, at least one print head (8) being provided for selective dispensing of at least one material onto a target surface in the form of droplets. The print head (8) is in engagement with a receptacle at two points spaced a distance apart, the position and alignment of the print head (8) relative to the target surface is steplessly adjustable in all spatial directions via these two points, and the receptacle and the target surface are movable in relation to each other.

Abstract: The present invention relates to a device for manufacture of three-dimensional models by means of a 3D printing process, whereby the build material is deposited on a build platform in layers and the build platform is moveable in the Z-direction and one or several drive units and one or several guide elements is/are provided to move the build platform. In so doing, drive units and guiding elements are arranged in such a way that a movement of the drive units is decoupled from the movement of the guiding elements.

Abstract: The present invention relates to a device for producing three-dimensional models by a layering technique, at least one print head (8) being provided for selective dispensing of at least one material onto a target surface in the form of droplets. The print head (8) is in engagement with a receptacle at two points spaced a distance apart, the position and alignment of the print head (8) relative to the target surface is steplessly adjustable in all spatial directions via these two points, and the receptacle and the target surface are movable in relation to each other.

Abstract: The invention relates to a device for constructing models in layers. A region for constructing models, preferably a construction platform, and a material applying device (4, 5) for applying material onto the region are provided. The material applying device (4, 5) is arranged in a movable manner over the region. The material applying device (4, 5) is designed as a portal (1, 1?) such that the material applying device can be moved over the region at least via two linear guides (2) arranged at opposite sides of the region, and the material applying device is arranged around the region such that a portal (1, 1?) is formed by at least two portions that extend laterally with respect to the region. At least one additional material applying device (4, 5) for applying an additional material onto the region is provided.

Abstract: The present invention relates to a device for producing three-dimensional models by a layering technique, at least one print head (8) being provided for selective dispensing of at least one material onto a target surface in the form of droplets. The print head (8) is in engagement with a receptacle at two points spaced a distance apart, the position and alignment of the print head (8) relative to the target surface is steplessly adjustable in all spatial directions via these two points, and the receptacle and the target surface are movable in relation to each other.

Abstract: The present invention relates to a method for producing three-dimensional objects based on computer-provided data, whereby a material is deposited in layers in a process chamber and the material is selectively solidified and/or bonded using a bonding apparatus and/or a solidifying apparatus in the process chamber, these steps being repeated. A conveyance of the material proceeds during the build process and proceeds continuously, sequentially and evenly up to an unpacking position.

Abstract: A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.

Abstract: The present invention relates to a device for manufacturing three-dimensional models by means of a 3D printing process, whereby a build platform for application of build material is provided and a support frame is arranged around the build platform, to which said support frame at least one device for dosing the particulate material and one device for bonding the particulate material is attached via the guiding elements and the support frame is moveable in a Z direction, which essentially means perpendicular to the base surface of the build platform, said movement provided by at least two vertical positioning units on the support frame. In this respect, it is provided that the positioning units are respectively separate components and are arrangeable on the support frame independently from one another and the location and orientation of such can be adjusted independently from one another.

Abstract: The present invention relates to a device for manufacturing three-dimensional models by means of a 3D printing process, whereby a build platform for application of build material is provided and a support frame is arranged around the build platform, to which said support frame at least one device for dosing the particulate material and one device for bonding the particulate material is attached via the guiding elements and the support frame is moveable in a Z direction, which essentially means perpendicular to the base surface of the build platform. In so doing, the device provides a material feeding device having a particle material container to supply particulate material in batches from the storage area to the dosing apparatus and to do so with the least possible amount of shearing forces and without significant interaction with the atmosphere.

Abstract: The present invention relates to a device for manufacture of three-dimensional models by means of a 3D printing process, whereby the build material is deposited on a build platform in layers and the build platform is moveable in the Z-direction and one or several drive units and one or several guide elements is/are provided to move the build platform. In so doing, drive units and guiding elements are arranged in such a way that a movement of the drive units is decoupled from the movement of the guiding elements.

Abstract: The invention relates to a method for switching a particulate material flow in the construction of models in layers, wherein particulate materials are fed to a subsequent method step from a container having an opening in the direction of a workpiece platform. The particles in the container are exposed to a vacuum and to overpressure.

Abstract: An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1 prevailing in the first pressure chamber and the pressure p2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper.

Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

Abstract: An apparatus for applying adhesive to a substrate (2) comprises a writing head (4) with a writing nozzle (5) and a camera (11). The writing head (4) can be moved in two horizontal directions so that it can write an adhesive pattern on the substrate (2). The position of the writing head (4) designated as the z height is controlled very accurately by means of a position measuring and control circuit (6) so that the tip of the writing nozzle (5) can be guided at a predetermined distance ?z0 above the substrate (2). In accordance with the invention, the apparatus is equipped with a triangulation measuring system with the aid of which the z height of the substrate (2) is determined and with a calibration device (15) for determining the relationship between the z position of the writing head (4) and the z height of the substrate (2).