Patents by Inventor Dominik Xaver Simon

Dominik Xaver Simon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED WAVEGUIDE LAUNCHER
    Publication number: 20220189894
    Abstract: An integrated circuit package comprising an encapsulant, a semiconductor die in the encapsulant the semiconductor die comprising a plurality of die terminals, an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals and a land grid array provided on a bottom surface of the package. The land grid array comprises a plurality of package terminals, each package terminal configured to be soldered to a printed circuit board, and an opening, wherein the opening is aligned with the integrated waveguide launcher.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 16, 2022
    Inventors: Abdellatif Zanati, Adrianus Buijsman, Dominik Xaver Simon