Patents by Inventor Dominik Zinner

Dominik Zinner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250125152
    Abstract: The invention relates to a method and a device for the compensation of distortions on a substrate surface of a substrate, a method for bonding two substrates and a product.
    Type: Application
    Filed: November 2, 2021
    Publication date: April 17, 2025
    Applicant: EV Group E. Thallner GmbH
    Inventors: Thomas Uhrmann, Markus Wimplinger, Friedrich Paul Lindner, Jurgen Burggraf, Thomas Wagenleitner, Dominik Zinner, Martin Finger, Harald Rohringer
  • Patent number: 12199062
    Abstract: The invention relates to a device and a method for the alignment of substrates.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: January 14, 2025
    Assignee: EV Group E. Thallner GmbH
    Inventors: Dominik Zinner, Friedrich Paul Lindner, Thomas Plach, Peter Starzengruber
  • Publication number: 20240420976
    Abstract: The invention relates to a method and a device for adjusting a detection means with the aid of adjustment marks arranged one above the other.
    Type: Application
    Filed: December 17, 2021
    Publication date: December 19, 2024
    Applicant: EV Group E. Thallner GmbH
    Inventors: Harald ROHRINGER, Martin FINGER, Dominik ZINNER
  • Patent number: 12025426
    Abstract: A measuring device for determining a course of a bonding wave in a gap between a first substrate and a second substrate, and a method for determining a course of a bonding wave in a gap between a first substrate and a second substrate.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: July 2, 2024
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Dominik Zinner, Jürgen Mallinger, Thomas Plach, Boris Povazay, Harald Rohringer, Jürgen Markus Süss
  • Publication number: 20230369095
    Abstract: The present invention relates to a substrate holder, a bonding device, a method for producing a substrate holder and a method for bonding.
    Type: Application
    Filed: February 1, 2021
    Publication date: November 16, 2023
    Applicant: EV Group E. Thallner GmbH
    Inventors: Dominik Zinner, Thomas Plach
  • Publication number: 20230207513
    Abstract: The invention relates to a device and a method for the alignment of substrates.
    Type: Application
    Filed: June 30, 2020
    Publication date: June 29, 2023
    Applicant: EV Group E. Thallner GmbH
    Inventors: Dominik Zinner, Friedrich Paul Lindner, Thomas Plach, Peter Starzengruber
  • Publication number: 20230207379
    Abstract: A substrate holder for curving a substrate the substrate holding including a fixing plate for fixing the substrate, curving means for curving the fixing plate, wherein the fixing plate is constituted such that the curvature of the substrate can be adjusted in a targeted manner, as well as a corresponding method.
    Type: Application
    Filed: June 29, 2020
    Publication date: June 29, 2023
    Applicant: EV Group E. Thallner GmbH
    Inventors: Dominik ZINNER, Thomas WAGENLEITNER, Jürgen Markus SÜSS, Thomas PLACH, Jürgen MALLINGER
  • Patent number: 11488851
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: November 1, 2022
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
  • Publication number: 20220173068
    Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Applicant: EV Group E. Thallner GmbH
    Inventors: Dominik ZINNER, Thomas WAGENLEITNER, Jurgen Markus SUSS, Thomas PLACH, Jurgen MALLINGER
  • Patent number: 11315901
    Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: April 26, 2022
    Assignee: EV Group E. Thallner GmbH
    Inventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Thomas Plach, Jurgen Mallinger
  • Publication number: 20220026196
    Abstract: The invention relates to a measuring device for determining a course of a bonding wave in a gap (3) between a first substrate (2) and a second substrate (4). Furthermore, the present invention relates to a corresponding method.
    Type: Application
    Filed: January 18, 2019
    Publication date: January 27, 2022
    Applicant: EV Group E. Thallner GmbH
    Inventors: Dominik ZINNER, Jürgen MALLINGER, Thomas PLACH, Boris POVAZAY, Harald ROHRINGER, Jürgen Markus SÜSS
  • Publication number: 20210151339
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 20, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
  • Patent number: 10991609
    Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: April 27, 2021
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Jurgen Mallinger, Thomas Plach
  • Patent number: 10943807
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: March 9, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
  • Publication number: 20200227299
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 16, 2020
    Applicant: EV Group E. Thallner GmbH
    Inventors: Thomas WAGENLEITNER, Dominik ZINNER, Jurgen Markus SUSS, Christian SINN, Jurgen MALLINGER
  • Patent number: 10692747
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: June 23, 2020
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
  • Publication number: 20200168580
    Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
    Type: Application
    Filed: September 21, 2017
    Publication date: May 28, 2020
    Applicant: EV Group E. Thallner GmbH
    Inventors: Dominik ZINNER, Thomas WAGENLEITNER, Jurgen Markus SUSS, Thomas PLACH, Jurgen MALLINGER
  • Publication number: 20200027768
    Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.
    Type: Application
    Filed: August 12, 2016
    Publication date: January 23, 2020
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Dominik ZINNER, Thomas WAGENLEITNER, Jurgen Markus SUSS, Jurgen MALLINGER, Thomas PLACH
  • Publication number: 20190198371
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.
    Type: Application
    Filed: August 29, 2016
    Publication date: June 27, 2019
    Applicant: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger