Patents by Inventor Dominique Ho
Dominique Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190181086Abstract: An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.Type: ApplicationFiled: February 15, 2019Publication date: June 13, 2019Inventors: Dominique Ho, Chris Tao, Boon Keat Tan
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Patent number: 10283699Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor. The output and input sides may be provided in an overlapping configuration.Type: GrantFiled: January 29, 2016Date of Patent: May 7, 2019Assignee: Avago Technologies International Sales Pte. LimitedInventors: Yin Yin Chew, Thiam Siew Gary Tay, Dominique Ho
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Patent number: 10236247Abstract: An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.Type: GrantFiled: October 31, 2017Date of Patent: March 19, 2019Assignee: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITEDInventors: Dominique Ho, Chris Tao, Boon Keat Tan
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Patent number: 9960671Abstract: A capacitive isolation system, capacitive isolator, and method of operating the same are disclosed. The capacitive isolation system is described to include a first semiconductor die and a second semiconductor die each having capacitive elements established thereon and positioned in a face-to-face configuration. An isolation layer is provided between the first and second semiconductor die so as to establish an isolation boundary therebetween. Capacitive coupling is used to carry information across the isolation boundary.Type: GrantFiled: December 31, 2014Date of Patent: May 1, 2018Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.Inventors: Dominique Ho, Kwee Chong Chang, Kah Weng Lee, Brian J. Misek
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Publication number: 20180068946Abstract: An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.Type: ApplicationFiled: October 31, 2017Publication date: March 8, 2018Inventors: Dominique Ho, Chris Tao, Boon Keat Tan
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Patent number: 9812389Abstract: An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.Type: GrantFiled: August 4, 2016Date of Patent: November 7, 2017Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.Inventors: Dominique Ho, Chris Tao, Boon Keat Tan
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Publication number: 20170222131Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor. The output and input sides may be provided in an overlapping configuration.Type: ApplicationFiled: January 29, 2016Publication date: August 3, 2017Inventors: Yin Yin Chew, Thiam Siew Gary Tay, Dominique Ho
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Publication number: 20170098604Abstract: An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.Type: ApplicationFiled: August 4, 2016Publication date: April 6, 2017Inventors: Dominique Ho, Chris Tao, Boon Keat Tan
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Patent number: 9520354Abstract: An isolation system, isolation capacitor, and Integrated Circuit are disclosed. The isolation capacitor is described to include a first capacitive element, a second capacitive element, a primary isolation layer positioned between the first and second capacitive elements, as well as a secondary isolation layer positioned between the first and second capacitive elements. The secondary isolation layer has an area that is larger than an area of one or both of the first and second capacitive elements, thereby reducing the likelihood of breakdown between the first and second capacitive elements.Type: GrantFiled: July 29, 2015Date of Patent: December 13, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Ricky Chow, Dominique Ho, Qian Tao
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Publication number: 20160190918Abstract: A capacitive isolation system, capacitive isolator, and method of operating the same are disclosed. The capacitive isolation system is described to include a first semiconductor die and a second semiconductor die each having capacitive elements established thereon and positioned in a face-to-face configuration. An isolation layer is provided between the first and second semiconductor die so as to establish an isolation boundary therebetween. Capacitive coupling is used to carry information across the isolation boundary.Type: ApplicationFiled: December 31, 2014Publication date: June 30, 2016Inventors: Dominique Ho, Kwee Chong Chang, Kah Weng Lee, Brian J. Misek
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Patent number: 9279946Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more premolded cavities with a light-coupling medium contained therein. Walls of the one or more premolded cavities advantageously help shape the light-coupling medium during manufacture, therefore, resulting in a light path with controlled shape and dimensions.Type: GrantFiled: May 23, 2012Date of Patent: March 8, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Gary Tay, Dominique Ho
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Patent number: 9000761Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor.Type: GrantFiled: January 19, 2012Date of Patent: April 7, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Gary Tay, Dominique Ho, Meng Yong Shie
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Publication number: 20130315533Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more premolded cavities with a light-coupling medium contained therein. Walls of the one or more premolded cavities advantageously help shape the light-coupling medium during manufacture, therefore, resulting in a light path with controlled shape and dimensions.Type: ApplicationFiled: May 23, 2012Publication date: November 28, 2013Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Gary Tay, Dominique Ho
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Publication number: 20130187644Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor.Type: ApplicationFiled: January 19, 2012Publication date: July 25, 2013Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Gary Tay, Dominique Ho, Meng Yong Shie
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Patent number: 8427844Abstract: Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.Type: GrantFiled: March 31, 2010Date of Patent: April 23, 2013Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Dominique Ho, Julie Fouquet
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Patent number: 8093983Abstract: Disclosed herein are various embodiments of narrowbody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.Type: GrantFiled: March 31, 2010Date of Patent: January 10, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Julie Fouquet, Dominique Ho
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Patent number: 7948067Abstract: In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.Type: GrantFiled: June 30, 2009Date of Patent: May 24, 2011Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Julie E. Fouquet, Richard A. Baumgartner, Gary Tay, Dominique Ho
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Publication number: 20100328902Abstract: In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Dominique Ho, Richard A. Baumgartner, Julie E. Fouquet, Gary Tay
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Publication number: 20100259909Abstract: Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.Type: ApplicationFiled: March 31, 2010Publication date: October 14, 2010Applicant: Avago Technologies ECBU (Singapore) Pte. Ltd.Inventors: Dominique Ho, Julie Fouquet
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Publication number: 20100188182Abstract: Disclosed herein are various embodiments of narrowbody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.Type: ApplicationFiled: March 31, 2010Publication date: July 29, 2010Applicant: Avago Technologies ECBU (Singapore) Pte.Ltd.Inventors: Julie Fouquet, Dominique Ho