Abstract: A memory includes a memory cell including a first terminal, a second terminal and a channel extending between the first terminal and the second terminal. The memory further includes an energy storage element configured to support a programming of the memory cell, the energy storage element being coupled to the first terminal, an energy supply coupled to the energy storage element, and a controller. The controller is configured to activate the energy supply and to bring the channel of the memory cell into a non-conductive state for energizing the energy storage element, and to subsequently bring the channel of the memory cell into a conductive state for programming the memory cell based on the energy stored in the energy storage element.

Abstract: A chip includes a memory array and a refresh counter. The refresh counter is configured to receive refresh trigger signals. The refresh counter is configured or configurable to initiate a refresh of the memory array only once per i of the received refresh trigger signals where i is a number greater than 1.

Abstract: A memory includes a memory cell including a first terminal, a second terminal and a channel extending between the first terminal and the second terminal. The memory further includes an energy storage element configured to support a programming of the memory cell, the energy storage element being coupled to the first terminal, an energy supply coupled to the energy storage element, and a controller. The controller is configured to activate the energy supply and to bring the channel of the memory cell into a non-conductive state for energizing the energy storage element, and to subsequently bring the channel of the memory cell into a conductive state for programming the memory cell based on the energy stored in the energy storage element.

Abstract: A lithographic mask comprises a first layer including grooves, a second layer including regions, sections and a groove-like structure that encloses the sections. The first and second layers are formed so as to reduce electrical potential differences within the second layer. A method of forming a lithographic mask includes forming first and second layers to dispose the second layer over the first layer, patterning the second layer to comprise sections, a region, and a groove-like structure enclosing the sections, and forming grooves in the first layer at portions not covered by the second layer. The first and second layers are formed to reduce potential differences within the second layers during the step of forming the grooves in the first layer.

Abstract: A device with a precharge/homogenize circuit. One embodiment provides at least one switching element is acting as a homogenizer, and at least one switching element is acting as a precharger. The diffusion region of the switching element acting as a homogenizer is separated from the diffusion region of the switching element acting as a precharger.

Abstract: A lithographic mask comprises a first layer including grooves, a second layer including regions, sections and a groove-like structure that encloses the sections. The first and second layers are formed so as to reduce electrical potential differences within the second layer. A method of forming a lithographic mask includes forming first and second layers to dispose the second layer over the first layer, patterning the second layer to comprise sections, a region, and a groove-like structure enclosing the sections, and forming grooves in the first layer at portions not covered by the second layer. The first and second layers are formed to reduce potential differences within the second layers during the step of forming the grooves in the first layer.

Abstract: A semiconductor memory device and method with a changeable substrate potential. One embodiment provides for operating a semiconductor memory device having at least one read or write/sense amplifier. The method includes changing the substrate potential of the read or write/sense amplifier.

Abstract: A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.

Abstract: An integrated circuit with buried control line structures. In one embodiment, the control lines are subdivided into sections, wherein regions free of switching transistors are provided at intervals along the control lines. Connections for feeding the control potentials into the sections of the control lines are provided at least in a subset of the regions free of switching transistors. The isolations lines are connected to one another by an interconnect running transversely with respect to the control lines.

Abstract: An integrated circuit includes a first connection and a memory circuit. The integrated circuit is switchable between a master mode of operation, in which a buffer between the first connection and the memory circuit is activated, and a slave mode of operation, in which the buffer between the first connection and the memory circuit is deactivated.

Abstract: A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.

Abstract: A chip includes a memory array and a refresh counter. The refresh counter is configured to receive refresh trigger signals. The refresh counter is configured or configurable to initiate a refresh of the memory array only once per i of the received refresh trigger signals where i is a number greater than 1.

Abstract: An integrated circuit includes a bit line pair having two bit lines, a sense amplifier having at least one transistor, the sense amplifier amplifying a charge difference between the bit lines of the bit line pair; and a control unit connected to a substrate terminal of the at least one transistor, the control unit applying a substrate potential dependent on an operating state of the integrated circuit to the substrate of the at least one transistor.

Abstract: A device with a precharge/homogenize circuit. One embodiment provides at least one switching element is acting as a homogenizer, and at least one switching element is acting as a precharger. The diffusion region of the switching element acting as a homogenizer is separated from the diffusion region of the switching element acting as a precharger.

Abstract: An integrated circuit includes a first connection and a memory circuit. The integrated circuit is switchable between a master mode of operation, in which a buffer between the first connection and the memory circuit is activated, and a slave mode of operation, in which the buffer between the first connection and the memory circuit is deactivated.

Abstract: Embodiments provide for integrated circuit chip and device having such an integrated circuit, in which different types of pads are arranged in separate rows. In one embodiment the pads are arranged to reduce the loop inductance of corresponding signal and power supply bond wires.

Abstract: A method for transferring data into a data memory using a data protocol is presented. The data memory is an error correction code (ECC) memory or a non-error correction code memory. The data protocol has different frames. When data are written into an ECC memory, the protocol includes a data mask frame in which the data mask bits are replaced by ECC bits. The method is designed such that ECC and non-ECC DRAMs can be established with the same protocol and at least a similar architecture.

Abstract: An integrated circuit with buried control line structures. In one embodiment, the control lines are subdivided into sections, wherein regions free of switching transistors are provided at intervals along the control lines. Connections for feeding the control potentials into the sections of the control lines are provided at least in a subset of the regions free of switching transistors. The isolations lines are connected to one another by an interconnect running transversely with respect to the control lines.

Abstract: A semiconductor memory device and method with a changeable substrate potential. One embodiment provides for operating a semiconductor memory device having at least one read or write/sense amplifier. The method includes changing the substrate potential of the read or write/sense amplifier.

Abstract: A semiconductor memory device including semiconductor memory cells with at least one memory cell capable of either acting as a storage device for ECC information or of acting as a redundant memory cell is provided. The semiconductor memory device further includes a signal control device for signaling if the at least one memory cell is to be used either as a storage device or as a redundant memory cell. A method of operating a semiconductor memory device is also provided including the steps of registering a status of a signal device and, depending on the status of the signal device, operating the at least one memory cell either as a storing device for ECC information or as a redundant memory cell.