Abstract: A semiconductor power device, e.g., an Insulated Gate Bi-polar Transistor (IGBT) or a Metal-Oxide Field Effect Transistor (MOSFET) may be constructed in a reusable and repairable cost-effective sealed shell. The switch may be provided with direct-pressure-contact caps which may perform as electrical conductors for a semiconductor die of the switch and also as thermal heat-sink contacts for the device. The switch may be provided with internal self-powered gate driving control and PHM incorporated in sealed shell. Embodiments of the switch may be constructed with no external gating/PHM connection pin penetrations through the shell.

Abstract: A semiconductor power device, e.g., an Insulated Gate Bi-polar Transistor (IGBT) or a Metal-Oxide Field Effect Transistor (MOSFET) may be constructed in a reusable and repairable cost-effective sealed shell. The switch may be provided with direct-pressure-contact caps which may perform as electrical conductors for a semiconductor die of the switch and also as thermal heat-sink contacts for the device. The switch may be provided with internal self-powered gate driving control and PHM incorporated in sealed shell. Embodiments of the switch may be constructed with no external gating/PHM connection pin penetrations through the shell.

Abstract: A method for cooling a transformer and transformer apparatuses are implemented. A transformer apparatus, according to one embodiment, comprises: a conduction cooled electrical transformer (240) mounted to a cold plate (252); and a heat pipe (262) for supplementing cooling of the transformer (240), the heat pipe (262) comprising a first end (303), a second end (305), and a sealed low pressure cavity containing an amount of a fluid (311), wherein the first end (303) of the heat pipe (262) is located in a hot region of the transformer (240), the second end (305) is maintained colder than the first end (303) by contact with the cold plate (252), and heat produced at the first end (303) by operation of the transformer (240) is moved to the second end (305) by a closed loop vapor cycle in the sealed low pressure cavity using the fluid (311) of the heat pipe (262).