Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: An adjustable EMI suppression core has an outer core having a first reluctance. The outer core has three apertures aligned horizontally. A first aperture and a third aperture are each suitable for a wire to be placed therein. A second aperture is located between the first and third apertures. An inner core is rotatable engaged in the second aperture, for example, using matching threads on an inner surface of the second aperture and an outer surface on the inner core. The inner core has first and third portions having a second reluctance similar to the first reluctance and a third portion having a reluctance considerably higher than the first and second reluctances. Rotating the inner core varies a normal mode and a common mode suppression of currents in the wires placed in the first and second apertures.

Abstract: A method, and structures are provided for implementing differential signal circuit board electrical contact. A removable member including a pair of independent electrical contacts is removably received within an associated contact-receiving cavity on the circuit board. The contact-receiving cavity includes a mating pair of circuit board pads. A respective dielectric is provided between each of the pair of independent electrical contacts and the mating pair of circuit board pads.

Abstract: An adjustable EMI suppression core has an outer core having a first reluctance. The outer core has three apertures aligned horizontally. A first aperture and a third aperture are each suitable for a wire to be placed therein. A second aperture is located between the first and third apertures. An inner core is rotatable engaged in the second aperture, for example, using matching threads on an inner surface of the second aperture and an outer surface on the inner core. The inner core has first and third portions having a second reluctance similar to the first reluctance and a third portion having a reluctance considerably higher than the first and second reluctances. Rotating the inner core varies a normal mode and a common mode suppression of currents in the wires placed in the first and second apertures.

Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: The present invention is directed to an apparatus that minimizes the effects of hand capacitance on a cable, the apparatus also being configured to generate and induce a charge, wherein the charge couples a capacitance to the cable, the capacitance matching a typical capacitance that a hand couples to a cable. The present invention is also generally directed to a method of performing a cable to electronic system electrostatic discharge immunity test.

Abstract: A method for installing a bonding pad as a gasket for an electronic subassembly includes providing a bonding pad comprising an expandable foam; an air-tight bladder covering at least one side of the expandable foam; a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and an open port; removing air from the air-tight bladder, thereby compressing the expandable foam; installing the bonding pad into a gap between two surfaces; allowing the compressed foam to expand under atmospheric pressure; and electrically bonding the two surfaces with the bonding pad.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: An assembly for dissipating heat generated by electronic components which include a ventilating panel having a plurality of vent holes arranged thereon. More specifically, the perforation pattern of vent holes is staggered to provide adjacent larger and smaller vent holes in at least two rows of vent holes. A second row of vent holes is staggered with respect to the first row of vent holes such that the larger vent holes are aligned with smaller vent holes, preferably in a ratio of two smaller vent holes per one larger vent hole. Such a perforation arrangement of vent holes may be provided on a blindswap cassette for securing and aligning computer cards for mounting in a housing, such as a sled for use in computer systems.

Abstract: The present invention generally relates to providing a controlled impedance connection between two PCBs. A connector may connect a first PCB to a second PCB. The connector may comprise of a body made from a dielectric material and a plurality of conductive lines defined in the dielectric material. One or more of the conductive lines may transfer one or more signals between the PCBs. A return path may be provided for each signal line. Furthermore, the width, length, and the proximity of a signal line and its associated return line may be selected to match the impedance of the connector to the impedance of the PCB. The connector may also contain one or more ferrite layers to suppress electromagnetic radiation caused by common mode currents.

Abstract: A method for installing a bonding pad as a gasket for an electronic subassembly includes providing a bonding pad comprising an expandable foam; an air-tight bladder covering at least one side of the expandable foam; a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and an open port; removing air from the air-tight bladder, thereby compressing the expandable foam; installing the bonding pad into a gap between two surfaces; allowing the compressed foam to expand under atmospheric pressure; and electrically bonding the two surfaces with the bonding pad.

Abstract: An assembly, system, and method particularly adapted for a magnetic resonator apparatus in a magnetic resonance imaging (MRI) scanning system. Provided is a restraining assembly supportable by the supporting assembly and including at least a system that is selectively operable for positioning and restraining at least a portion of the body to be imaged, thereby optimizing image quality.

Abstract: In one embodiment, this invention is about stacking of sheeted material after cuts. The patterns on the separate sheets are aligned for cuts to create through-holes in the stack. The cut material is not removed but simply bent back to form walls for the hole. The materials are pierced and stacked to form holes. Any additional extended walls to the hole can be formed just by adding an additional layer. One embodiment may be just 2 walls that form a 90 degree angle with respect to one another. The extended walls can be slightly bent along their lengths in order to increase their strengths and to ensure their perpendicular standing on the layers. In other embodiments, the extended walls can be equipped with extra features, such as latches, to secure the adjacent extended walls and ensure a 90 degree angle between them.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: A portable ionizer is arranged for generating ionized air in an area of a user's fingers. The portable ionizer includes a battery-powered oscillator coupled via a high voltage conversion circuit to a positive electrode and a negative electrode for generating positive and negative ions. A fan positioned near the positive and negative electrodes is arranged providing a positive and negative ion flow path to the area of the user's fingers.

Abstract: The present invention generally relates to providing a controlled impedance connection between two PCBs. A connector may connect a first PCB to a second PCB. The connector may comprise of a body made from a dielectric material and a plurality of conductive lines defined in the dielectric material. One or more of the conductive lines may transfer one or more signals between the PCBs. A return path may be provided for each signal line. Furthermore, the width, length, and the proximity of a signal line and its associated return line may be selected to match the impedance of the connector to the impedance of the PCB. The connector may also contain one or more ferrite layers to suppress electromagnetic radiation caused by common mode currents.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

Abstract: A method, apparatus, and a localized in-line cable filter system are provided for implementing electromagnetic cable noise suppression. The localized in-line cable filter system includes at least one electromagnetic interference (EMI) filter element connected between a cable and a current return path. An insulation displacement terminal connects the EMI filter element to the cable. The EMI filter element and current return path provide a low impedance connection toward a source.