Patents by Inventor Don Bautista

Don Bautista has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sacrificial wafer probe pads through seal ring for electrical connection to circuit inside an integrated circuit
    Patent number: 9048201
    Abstract: The disclosure is directed to a semiconductor wafer, integrated circuit product, and method of making same, having multiple non-singulated chips separated by scribe lines, comprising a plurality of seal rings, each seal ring surrounding a corresponding chip and disposed between the corresponding chip and adjacent scribe lines. Well resistors are disposed below the seal rings and probe pads disposed in the scribe lines. In particular, at least one of the probe pads is coupled by at least one of the well resistors to at least one of the chips.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: June 2, 2015
    Assignee: Broadcom Corporation
    Inventors: Frank Hui, Neal Kistler, Don Bautista
  • Sacrificial Wafer Probe Pads Through Seal Ring for Electrical Connection to Circuit Inside an Integrated Circuit
    Publication number: 20120326146
    Abstract: The disclosure is directed to a semiconductor wafer, integrated circuit product, and method of making same, having multiple non-singulated chips separated by scribe lines, comprising a plurality of seal rings, each seal ring surrounding a corresponding chip and disposed between the corresponding chip and adjacent scribe lines. Well resistors are disposed below the seal rings and probe pads disposed in the scribe lines. In particular, at least one of the probe pads is coupled by at least one of the well resistors to at least one of the chips.
    Type: Application
    Filed: June 23, 2011
    Publication date: December 27, 2012
    Applicant: Broadcom Corporation
    Inventors: Frank Hui, Neal Kistler, Don Bautista