Patents by Inventor Don Bruner

Don Bruner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealing porous dielectric materials
    Patent number: 7560165
    Abstract: Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may besealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: July 14, 2009
    Assignee: Intel Corporation
    Inventors: Grant Kloster, Robert P. Meagley, Michael D. Goodner, Kevin P. O'brien, Don Bruner
  • Sealing porous dielectric materials
    Publication number: 20050227094
    Abstract: Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may be sealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
    Type: Application
    Filed: June 7, 2005
    Publication date: October 13, 2005
    Inventors: Grant Kloster, Robert Meagley, Michael Goodner, Kevin O'brien, Don Bruner