Patents by Inventor Don Channa K. Kaluarachchi

Don Channa K. Kaluarachchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor substrate supports with embedded RF shield
    Patent number: 11049755
    Abstract: Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 29, 2021
    Assignee: Applied Materials, Inc.
    Inventors: David Benjaminson, Michael Grace, Soonam Park, Dmitry Lubomirsky, Jaeyong Cho, Nikolai Kalnin, Don Channa K Kaluarachchi
  • SEMICONDUCTOR SUBSTRATE SUPPORTS WITH EMBEDDED RF SHIELD
    Publication number: 20200090972
    Abstract: Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 19, 2020
    Applicant: Applied Materials, Inc.
    Inventors: David Benjaminson, Michael Grace, Soonam Park, Dmitry Lubomirsky, Jaeyong Cho, Nikolai Kalnin, Don Channa K. Kaluarachchi