Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: A building power management system is disclosed. The system includes a stationary energy storage device and a rechargeable, portable energy storage device. The stationary energy storage device includes a charging dock for receiving and charging the portable energy storage device. The stationary energy storage device can charge the portable energy storage device even when an electrical grid is unavailable. The portable energy storage device can provide power for other devices. Based at least in part on charge levels of the stationary energy storage device and the portable energy storage device, the power management system controls charging and discharging of the stationary energy storage device and the portable energy storage device.

Abstract: A coil former, also referred to herein as a bobbin, is provided for use in conduction-cooled magnetic components that contain an air gap. The diameter of the disclosed bobbin is increased and ribs/splines or tabs are created to keep the winding centered about the core center post while allowing thermally conductive silicone-based or equivalent encapsulant to fill the voids between the coil former and the core, the coil former and the windings and/or both depending on the placement of the locating tabs. The disclosed bobbin may be fabricated from traditional injection molding resins or from high-thermal conductivity resins. As a result of the disclosed bobbin designs, the achievable power density is increased while maintaining acceptable temperatures.

Abstract: A coil former, also referred to herein as a bobbin, is provided for use in conduction-cooled magnetic components that contain an air gap. The diameter of the disclosed bobbin is increased and ribs/splines or tabs are created to keep the winding centered about the core center post while allowing thermally conductive silicone-based or equivalent encapsulant to fill the voids between the coil former and the core, the coil former and the windings and/or both depending on the placement of the locating tabs. The disclosed bobbin may be fabricated from traditional injection molding resins or from high-thermal conductivity resins. As a result of the disclosed bobbin designs, the achievable power density is increased while maintaining acceptable temperatures.

Abstract: A device includes: an electronic component that generates heat; a heatsink configured to absorb at least part of the heat through thermal transfer; and a thermally conductive dielectric pad that attaches the electronic component and the heatsink to each other and facilitates the thermal transfer. The thermally conductive dielectric pad includes: a ceramic tile; a first layer of adhesive that attaches a first side of the ceramic tile to the electronic component; and a second layer of adhesive that attaches a second side of the ceramic tile to the heatsink.

Abstract: There is disclosed a manipulator for positioning an interface of an automatic test system. In an embodiment, the manipulator includes a support device to support the interface. A base portion is in connection to the support device. The base portion includes a rotational adjustment mechanism for moving the support device about an axis of rotation. A planar adjustment mechanism moves the support device within a plane orthogonal to the axis of rotation. There is disclosed a method of positioning an interface unit of an automatic test system. In an embodiment, the method includes moving a support device supporting the interface unit a distance from a docking region of a material handling device; and rotating the support device about an axis of rotation passing through the interface unit. Other embodiments are also disclosed.

Abstract: A device for storing and deploying cable, including but not limited to optical fiber cable. The device includes a substantially planar bottom support surface having juxtaposed thumb segments and an intervening finger segment. An outer wall is affixed to the bottom surface about its perimeter and extends upwardly therefrom. A substantially circular guide wall is disposed on the bottom surface extending upwardly therefrom. A substantially circular inner wall is concentrically arranged with respect to the guide wall. A top flange is joined to the support surface by the outer wall and, together with the thumb segments, form entry and exit ports for the cable. The guide wall and the inner wall define a guide track that is dimensioned so as to enable continuous adjustment of variable lengths of cable in an area of the device bounded by the guide track, the outer wall and a transverse barrier that extends the length of the finger segment.

Abstract: In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.