Patents by Inventor Don Chul Choi

Don Chul Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10333358
    Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electric power according to an embodiment of the present invention includes a substrate, a first soft magnetic layer stacked on the substrate, and including a soft magnetic material, and a receiving coil configured to receive electromagnetic energy emitted from a wireless power transmission device, and including a first coil layer wound in parallel with the soft magnetic layer, and a second coil layer electrically connected to the first coil layer and wound in parallel with the first coil layer, and a current direction of the first coil layer is opposite to a current direction of the second coil layer.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 25, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seok Bae, Yu Seon Kim, Sang Hak Lee, Don Chul Choi, Soon Young Hyun
  • Publication number: 20180262064
    Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electric power according to an embodiment of the present invention includes a substrate, a first soft magnetic layer stacked on the substrate, and including a soft magnetic material, and a receiving coil configured to receive electromagnetic energy emitted from a wireless power transmission device, and including a first coil layer wound in parallel with the soft magnetic layer, and a second coil layer electrically connected to the first coil layer and wound in parallel with the first coil layer, and a current direction of the first coil layer is opposite to a current direction of the second coil layer.
    Type: Application
    Filed: May 9, 2018
    Publication date: September 13, 2018
    Inventors: SEOK BAE, YU SEON KIM, SANG HAK LEE, DON CHUL CHOI, SOON YOUNG HYUN
  • Patent number: 9997950
    Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electric power according to an embodiment of the present invention includes a substrate, a first soft magnetic layer stacked on the substrate, and including a soft magnetic material, and a receiving coil configured to receive electromagnetic energy emitted from a wireless power transmission device, and including a first coil layer wound in parallel with the soft magnetic layer, and a second coil layer electrically connected to the first coil layer and wound in parallel with the first coil layer, and a current direction of the first coil layer is opposite to a current direction of the second coil layer.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 12, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seok Bae, Yu Seon Kim, Sang Hak Lee, Don Chul Choi, Soon Young Hyun
  • Publication number: 20180047505
    Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.
    Type: Application
    Filed: October 23, 2017
    Publication date: February 15, 2018
    Inventors: Soon Young Hyun, Seok Bae, Don Chul Choi, So Yeon Kim, Ji Yeon Song, Jai Hoon Yeom, Nam Yang Lee, Hyung Eui Lee
  • Patent number: 9831022
    Abstract: An embodiment of the present invention relates to a magnetic sheet having both an electromagnetic field shielding function and a heat dissipating function, and to a wirelessly charged magnetic member using same.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: November 28, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: So Yeon Kim, Seok Bae, Soon Young Hyun, Jai Hoon Yeom, Sang Won Lee, Hee Jung Lee, Don Chul Choi
  • Patent number: 9825482
    Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: November 21, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Soon Young Hyun, Seok Bae, Don Chul Choi, So Yeon Kim, Ji Yeon Song, Jai Hoon Yeom, Nam Yang Lee, Hyung Eui Lee
  • Publication number: 20160268033
    Abstract: An embodiment of the present invention relates to a magnetic sheet having both an electromagnetic field shielding function and a heat dissipating function, and to a wirelessly charged magnetic member using same.
    Type: Application
    Filed: October 8, 2014
    Publication date: September 15, 2016
    Applicant: LG INNOTECK CO. LTD.
    Inventors: So Yeon Kim, Seok Bae, Soon Young Hyun, Jai Hoon Yeom, Sang Won Lee, Hee Jung Lee, Don Chul Choi
  • Publication number: 20150236545
    Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.
    Type: Application
    Filed: October 4, 2013
    Publication date: August 20, 2015
    Inventors: Soon Young Hyun, Seok Bae, Don Chul Choi, So Yeon Kim, Ji Yeon Song, Jai Hoon Yeom, Nam Yang Lee, Hyung Eui Lee
  • Patent number: 8068347
    Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: November 29, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
  • Patent number: 7843702
    Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: November 30, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
  • Patent number: 7663892
    Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: February 16, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
  • Publication number: 20090268418
    Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
    Type: Application
    Filed: May 7, 2009
    Publication date: October 29, 2009
    Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon
  • Publication number: 20090268419
    Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
    Type: Application
    Filed: May 7, 2009
    Publication date: October 29, 2009
    Inventors: Don Chul Choi, Jae Cheol Ju, Dong Hwan Lee, Sang Soo Park, Hee Soo Yoon