Patents by Inventor DON DELANEY

DON DELANEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11814848
    Abstract: A mounting clip assembly for attaching a girt to a substrate, includes a bracket and isolator pad. The bracket includes a substrate fastening plate for mounting the bracket to a building substrate, and a girt fastening plate protruding orthogonally outward from a first face of the substrate fastening plate. The girt fastening plate has a top edge, and a bottom edge that extends at an upward angle from the substrate fastening plate, such that the vertical fastening plate is substantially trapezoidal. A girt may be fastened to the mounting clip assembly in a first fastening region. A cavity is formed in the girt fastening plate at a location between the substrate fastening plate and the fastening region to reduce thermal conductance between the fastening region and the substrate fastening plate. The cavity is reinforced by thickening material around a periphery of the cavity. The thermal isolator pad is mountable between a second face of the substrate fastening plate and the substrate.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: November 14, 2023
    Assignee: FLYNN CANADA LTD.
    Inventors: Don Delaney, Joe Baz
  • Publication number: 20230119188
    Abstract: A mounting clip assembly for attaching a girt to a substrate, includes a bracket and isolator pad. The bracket includes a substrate fastening plate for mounting the bracket to a building substrate, and a girt fastening plate protruding orthogonally outward from a first face of the substrate fastening plate. The girt fastening plate has a top edge, and a bottom edge that extends at an upward angle from the substrate fastening plate, such that the vertical fastening plate is substantially trapezoidal. A girt may be fastened to the mounting clip assembly in a first fastening region. A cavity is formed in the girt fastening plate ata location between the substrate fastening plate and the fastening region to reduce thermal conductance between the fastening region and the substrate fastening plate. The cavity is reinforced by thickening material around a periphery of the cavity. The thermal isolator pad is mountable between a second face of the substrate fastening plate and the substrate.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 20, 2023
    Inventors: Don Delaney, Joe Baz
  • Patent number: 11203876
    Abstract: A cladding system that is used to form a building envelope is disclosed. The system includes pre-fabricated modular cladding panels, each including a composite layer mounted onto metal or alloy sub-frame. The composite layer provides an outer insulation to the system, and a generally flat outer surface to which a veneer may be mounted. The composite layer further acts as an air and vapour barrier for the building envelope. The sub-frames may connect to one another by a tongue and groove interconnect.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: December 21, 2021
    Assignee: FLYNN CANADA LTD.
    Inventors: Don Delaney, John McManus, Tyler Koshurba
  • Publication number: 20200378134
    Abstract: A cladding system that is used to form a building envelope is disclosed. The system includes pre-fabricated modular cladding panels, each including a composite layer mounted onto metal or alloy sub-frame. The composite layer provides an outer insulation to the system, and a generally flat outer surface to which a veneer may be mounted. The composite layer further acts as an air and vapour barrier for the building envelope. The sub-frames may connect to one another by a tongue and groove interconnect.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 3, 2020
    Inventors: DON DELANEY, John McManus, Tyler Koshurba