Patents by Inventor Don Hiscock

Don Hiscock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure including a degradable tie layer
    Publication number: 20060194010
    Abstract: This invention relates to a packaging structure having degradable properties; comprising, (A) a substrate layer; (B) a resin layer; and (C) a degradable tie layer; wherein the degradable tie layer resides between the substrate layer and the resin layer. Further, the invention relates to a process for making a packaging structure having degradable properties; comprising, applying between (A) a substrate layer; and (B) a resin layer; (C) a degradable tie layer.
    Type: Application
    Filed: February 28, 2005
    Publication date: August 31, 2006
    Inventor: Don Hiscock