Abstract: A method for pre-treatment of a surface of a substrate prior to electroless copper deposition, the method including a) providing a substrate including an activated surface on a nonconductive material, the activated surface having an activator including a catalyzing metal; b) contacting the activated surface with an aqueous pre-treatment solution for pre-treating, the aqueous pre-treatment solution including copper ions, an inorganic acid, and a reducing agent, and having a pH below 6 to obtain a pre-treated surface; with the proviso that the reducing agent is capable to reduce copper ions in an alkaline pH, but not capable to reduce copper ions at pH below 6.

Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.