Abstract: Various embodiments disclosed relate to method of forming organosilicon products. In various embodiments, the present invention provides a method of forming an organosilicon product that can include contacting a first side of a silicone membrane with a nonvolatile liquid reactant. The method can include contacting a second side of the membrane with a gaseous reactant. The contacting can be sufficient to react the gaseous reactant with the liquid reactant to form an organosilicon product on the first side of the silicone membrane. The silicone membrane can be substantially impermeable to the liquid reactant and substantially permeable to the gaseous reactant.

Abstract: A fluorinated compound having at least one (meth)acrylate functional group disclosed. A curable composition comprising the fluorinated compound and polyfunctional acrylate, a cured product formed from the curable composition, and method of forming the cured product are also disclosed.

Abstract: Various embodiments disclosed relate to method of forming organosilicon products. In various embodiments, the present invention provides a method of forming an organosilicon product that can include contacting a first side of a silicone membrane with a nonvolatile liquid reactant. The method can include contacting a second side of the membrane with a gaseous reactant. The contacting can be sufficient to react the gaseous reactant with the liquid reactant to form an organosilicon product on the first side of the silicone membrane. The silicone membrane can be substantially impermeable to the liquid reactant and substantially permeable to the gaseous reactant.

Abstract: An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.

Abstract: A fluorinated compound having at least one (meth)acrylate functional group disclosed. A curable composition comprising the fluorinated compound and polyfunctional acrylate, a cured product formed from the curable composition, and method of forming the cured product are also disclosed.

Abstract: An additive for a silicone encapsulant has the structure: (I) R1Ce(OSi—R2) I I a R3 wherein a is 3 or 4, wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.

Abstract: An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.

Abstract: An additive for a silicone encapsulant has the structure: (I) R1Ce(OSi—R2) I I a R3 wherein a is 3 or 4, wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.

Abstract: A method for enhancing the dielectric properties of a new or in-service electrical cable is disclosed, the method comprising supplying the interstitial void space of the cable's conductor with a fluid mixture comprising(A) an antitreeing agent; and(B) a water-reactive compound,wherein (B) has a diffusion coefficient of at least 1.times.10.sup.-7 cm.sup.2 /second at 50.degree. C. in the insulation of the cable and the mixture has an initial viscosity of .ltoreq.100 cP at 25.degree. C. The instant method provides a more symmetrical distribution of dielectric enhancing fluid in the insulation than prior art fluids and results in a significant reduction in cable treatment time.

Abstract: A method for enhancing the dielectric properties of a new or in-service electrical cable is disclosed, the method comprising supplying the interstitial void space of the cable's conductor with a water-reative antitreeing agent having a diffusion coefficient of at least 1.times.10.sup.-7 cm.sup.2 /second at 50.degree. C. in the insulation of the cable and having an initial viscosity of .ltoreq.100 cP at 25.degree. C. The instant method provides a more symmetrical distribution of dielectric enhancing fluid in the insulation than prior art fluids and results in a significant reduction in cable treatment time.

Abstract: This invention discloses a method of controlling hydrosilylations in a reaction mixture by controlling the solution concentration of oxygen in the reaction mixture, relative to any platinum present in the reaction mixture. This invention further discloses a method for controlling isomerization in linear or branched alkenyl compounds having at least 4 carbon atoms during a hydrosilylation reaction by introducing a controlled amount of oxygen into the alkenyl compounds during the hydrosilylation. This invention further discloses a method for producing dicycloalkylsubstituted silanes by reacting a halo-or alkoxy-silane with a unsaturated cycloalkenyl compound in the presence of oxygen and a hydrosilylation catalyst.

Abstract: The present invention relates to a process for the production of mixtures of novel organofunctional alkoxysilanes by the reaction of mixtures of certain substituted organic halides and chlorosilanes with molten sodium dispersed in alkoxysilanes. In the described process, the substituted organic groups of the organic halide replace alkoxy groups of the alkoxysilanes. Also claimed, are organofunctional alkoxysilanes prepared by the claimed process.