Abstract: Methods for manufacturing a semiconductor device package (10) with a leadframe (14) to plastic (12) mold lock are disclosed along with the associated package (10). A method of the invention discloses manufacturing a packaged semiconductor device (10) using steps for forming a leadframe (14) with at least one borehole (20). The borehole (20) region of the leadframe (14) is coined such that a lip (34) is formed at the junction of the borehole (20) and a leadframe (14) surface. Encapsulating the lip (34) with mold compound (12) forms a leadframe (14) to plastic (12) lock incorporated in the completed semiconductor device package (10).

Abstract: A method of using a processor-based integrated circuit (IC) tester (12) to automatically invoke diagnostic testing. A diagnostic schedule (30) is user-defined (FIG. 3), and checked by the tester (12) at various times, such as before and after the tester 12 tests an IC lot (FIGS. 6, 7, 8). The schedule (30) has various scheduling parameters that permit diagnostic testing to be scheduled to occur at certain times, at the expiration of intervals, or upon certain events. The schedule (30) also permits different levels of diagnostic testing, each level with its own schedule. The tester (12) is programmed to run an appropriate level of diagnostic testing if more than one level is due to occur.