Patents by Inventor Don Michael

Don Michael has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for a micro-electro mechanical device
    Patent number: 9006877
    Abstract: A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: April 14, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Don Michael, Mari J. Rossman, Bradley Bower, Charles Craig Haluzak, John R. Sterner, Quan Qi, John Kane
  • System and method for hermetically sealing a package
    Patent number: 7550859
    Abstract: A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: June 23, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Don Michael, Mari J. Rossman
  • PACKAGE FOR A MICRO-ELECTRO MECHANICAL DEVICE
    Publication number: 20090057790
    Abstract: A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.
    Type: Application
    Filed: October 31, 2008
    Publication date: March 5, 2009
    Inventors: Don Michael, Mari J. Rossman, Bradley Bower, Charles Craig Haluzak, John R. Sterner, Quan Qi, John Kane
  • Package for a micro-electro mechanical device
    Patent number: 7465600
    Abstract: A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: December 16, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Don Michael, Mari J. Rossman, Bradley Bower, Charles Craig Haluzak, John R. Stemer, Quan Qi, John Kane
  • System and Method for Hermetically Sealing a Package
    Publication number: 20070290309
    Abstract: A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.
    Type: Application
    Filed: August 21, 2007
    Publication date: December 20, 2007
    Inventors: Don Michael, Mari Rossman
  • System and method for hermetically sealing a package
    Patent number: 7276398
    Abstract: A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: October 2, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Don Michael, Mari J. Rossman
  • Package for a micro-electro mechanical device
    Publication number: 20050173769
    Abstract: A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.
    Type: Application
    Filed: February 9, 2004
    Publication date: August 11, 2005
    Inventors: Don Michael, Mari Rossman, Bradley Bower, Charles Haluzak, John Stemer, Quan Qi, John Kane
  • System and method for hermetically sealing a package
    Publication number: 20050089283
    Abstract: A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.
    Type: Application
    Filed: October 23, 2003
    Publication date: April 28, 2005
    Inventors: Don Michael, Mari Rossman