Abstract: A ring device is adapted for wearing on at least one finger of a user. The ring device includes a wearable main body portion and an optical member that is moveably affixed thereto. The optical member can be positioned in at least two positions: a viewing position, and a storage position. The optical member may be moved relative to the main body portion through a number of positioning mechanisms including: a hinged member, a sliding member, and a rotating member. The viewing position may include any number positions for viewing an object in a field of view. The storage position corresponds to an alignment of the optical member with the main body such that the device is aesthetically pleasing. A face of the main body may include an insignia or other decorative design that is viewable through the optical member, and may optionally be removable by the user.

Abstract: An integrator circuit having a relatively large RC time constant includes a resistive element implemented with a field effect transistor operated in a sub-threshold mode. The size of the field effect transistor is selected, in addition to the sub-threshold gate voltage, to achieve a desired resistance value in a small area and without using bipolar devices. A differential integrator circuit includes two field effect transistors operated in a sub-threshold mode, with a capacitor connected between the output terminals of the two field effect transistors. A bulk drive circuit can be optionally used to reduce high frequency in the bulk.

Abstract: An integrator circuit having a relatively large RC time constant includes a resistive element implemented with a field effect transistor operated in a sub-threshold mode. The size of the field effect transistor is selected, in addition to the sub-threshold gate voltage, to achieve a desired resistance value in a small area and without using bipolar devices. A differential integrator circuit includes two field effect transistors operated in a sub-threshold mode, with a capacitor connected between the output terminals of the two field effect transistors. A bulk drive circuit can be optionally used to reduce high frequency in the bulk.

Abstract: A VCO and filter each include a variable transconductance amplifier as a resistive element. The same control bias current is supplied to the variable transconductance amplifier of both the oscillator and filter. This control bias current may be externally supplied, or may be generated on-chip from a thermal RC network formed from base-emitter junctions of bipolar transistors arrayed in single crystal silicon about a heat source. Application of a clock signal from the VCO to the heat source generates a heat pulse which propagates across the arrayed transistors. The resulting change in temperature produces a change in Vbe of the arrayed transistors. The phase shift between the original clock signal and the changed Vbe is determined solely by the time constant &tgr; of the particular thermal RC network. This time constant is a function of the inherent stable thermal resistance and capacitance of the single crystal silicon, and of the location and relative spacing of the arrayed transistors.

Abstract: A thermal RC network is fabricated in silicon as a lateral array of forward-biased PN junctions, which may take the form of the base-emitter junctions of bipolar transistors. Application of a clock signal from a voltage controlled oscillator to the silicon produces a heat pulse which propagates across the arrayed transistors of the thermal RC network. The resulting change in temperature produces a change in the V.sub.be of the arrayed transistors. The phase shift between the original clock signal and the changed V.sub.be is determined solely by the time constant .tau. of the particular thermal RC network. This time constant is a function only of the intrinsic thermal resistance and thermal capacitance of the silicon and the spacing of the laterally-arrayed transistors. The time constant is independent of the amplitude, frequency, and duty cycle of the original clock signal. The original clock signal and the time-delayed output of the RC network can be compared, and the phase shift determined.

Abstract: A modular system and a method of creating a modular system comprising a substantially rigid frame and a plurality of modules mounted at predetermined locations on the frame by means of kinematic couplings. The frame includes a main beam in the form of a spine, and a plurality of transversely extending bulkheads. The method includes creating a model of the system using rigid bodies and thereafter providing the frame and modules and securing them kinematically. The kinematic couplings comprise three pairs of aligning elements, each in the form of a male element and a contact element. The contact elements may take the form of grooves, tetrahedral depressions, or flat surfaces.

Abstract: A multi-stage telescoping tube structure and a robot including a multi-stage telescoping tube structure. The multi-stage telescoping tube structure includes an outer tube, an intermediate tube, and an inner tube. The intermediate tube is slidably received in the outer tube, and the inner tube is slidably received in the intermediate tube. It further includes a multi-stage screw for arrangement translating rotary motion into linear movement of the tubes, and a drive means coupled to the screw arrangement. The robot further includes a support bracket, rotatably supporting the multi-stage telescoping tube structure, and an electric motor for rotating the arrangement. The structure further includes rail guides engagable with complimentary horizontally extending rails for horizontal movement of the robot.

Abstract: A wafer gripper assembly comprises first and second gripping members movably supported relative to each other. A motor propels the gripping members linearly towards and away from each other. Preferably both gripping members are movably supported, and a rotary-to-linear translator produces equal and opposite linear movement of the gripping members. Typically, at least six contactor elements are defined on the pair of gripping members. The contactor elements include a vertically extending portion having an inwardly facing convex surface for contacting an edge of a wafer, and an inwardly extending flange for supporting a lower surface of the wafer.