Patents by Inventor Don Saunders

Don Saunders has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7944028
    Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: May 17, 2011
    Inventors: Don Saunders, Gabe Cherian
  • Publication number: 20090032915
    Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.
    Type: Application
    Filed: May 27, 2008
    Publication date: February 5, 2009
    Inventors: Gabe Cherian, Don Saunders