Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.

Abstract: One embodiment of an apparatus includes a semiconductor chip having a processor and an on-die non-volatile storage resource. The on-die non-volatile storage may store different, appropriate performance related information for different configurations and usage cases of the processor for a same performance state of the processor.

Abstract: Embodiments of a system and method for triggering an event in a hardware abstraction layer (HAL) are generally described herein. In some embodiments, the HAL can include unarchitected hardware or software that can be used to, for example, facilitate instruction emulation and debug; enable protection of model specific resources, instructions, and behaviors; redirect, resteer, or substitute instructions; and provide a framework for additional capabilities and features.

Abstract: One embodiment of an apparatus includes a semiconductor chip having a processor and an on-die non-volatile storage resource. The on-die non-volatile storage may store different, appropriate performance related information for different configurations and usage cases of the processor for a same performance state of the processor.

Abstract: One embodiment of an apparatus includes a semiconductor chip having a processor and an on-die non-volatile storage resource. The on-die non-volatile storage may store different, appropriate performance related information for different configurations and usage cases of the processor for a same performance state of the processor.

Abstract: A processor may include a core and an uncore area. The power consumed by the core area may be controlled by controlling the Cdyn of the processor such that the Cdyn is within an allowable Cdyn value irrespective of the application being processed by the core area. The power management technique includes measuring digital activity factor (DAF), monitoring architectural and data activity levels, and controlling power consumption by throttling the instructions based on the activity levels. As a result of throttling the instructions, throttling may be implemented in 3rd droop and thermal design point (TDP). Also, the idle power consumed by the uncore area while the core area is in deep power saving states may be reduced by varying the reference voltage VR and the VP provided to the uncore area. As a result, the idle power consumed by the uncore area may be reduced.

Abstract: A processor may include a core and an uncore area. The power consumed by the core area may be controlled by controlling the dynamic capacitance of the processor such that the dynamic capacitance is within an allowable dynamic capacitance value irrespective of the application being processed by the core area. The power management technique includes measuring digital activity factor (DAF), monitoring architectural and data activity levels, and controlling power consumption by throttling the instructions based on the activity levels. As a result of throttling the instructions, throttling may be implemented in 3rd droop and thermal design point (TDP). Also, the idle power consumed by the uncore area while the core area is in deep power saving states may be reduced by varying the reference voltage VR and the VP provided to the uncore area. As a result, the idle power consumed by the uncore area may be reduced.

Abstract: An apparatus that includes a semiconductor chip having a processor and an on-die non-volatile storage resource is described. The on-die non volatile storage is to store different, appropriate performance related information for different configurations and/or usage cases of the processor for a same performance state of the processor.

Abstract: Embodiments of a system and method for triggering an event in a hardware abstraction layer (HAL) are generally described herein. In some embodiments, the HAL can include unarchitected hardware or software that can be used to, for example, facilitate instruction emulation and debug; enable protection of model specific resources, instructions, and behaviors; redirect, resteer, or substitute instructions; and provide a framework for additional capabilities and features.

Abstract: According to one embodiment, a processor includes an execution pipeline for executing a plurality of threads, including a first thread and a second thread. The processor further includes a multi-thread controller (MTC) coupled to the execution pipeline to determine whether to switch threads between the first and second thread based on a thread switch policy that is selected from a list of thread switch policies based on unfairness levels of the first and second thread, and in response to determining to switch threads, to switch from executing the first thread to executing the second thread.

Abstract: An apparatus that includes a semiconductor chip having a processor and an on-die non-volatile storage resource is described. The on-die non volatile storage is to store different, appropriate performance related information for different configurations and/or usage cases of the processor for a same performance state of the processor.

Abstract: A processor may include a core and an uncore area. The power consumed by the core area may be controlled by controlling the Cdyn of the processor such that the Cdyn is within an allowable Cdyn value irrespective of the application being processed by the core area. The power management technique includes measuring digital activity factor (DAF), monitoring architectural and data activity levels, and controlling power consumption by throttling the instructions based on the activity levels. As a result of throttling the instructions, throttling may be implemented in 3rd droop and thermal design point (TDP). Also, the idle power consumed by the uncore area while the core area is in deep power saving states may be reduced by varying the reference voltage VR and the VP provided to the uncore area. As a result, the idle power consumed by the uncore area may be reduced.

Abstract: A processor may include a core and an uncore area. The power consumed by the core area may be controlled by controlling the Cdyn of the processor such that the Cdyn is within an allowable Cdyn value irrespective of the application being processed by the core area. The power management technique includes measuring digital activity factor (DAF), monitoring architectural and data activity levels, and controlling power consumption by throttling the instructions based on the activity levels. As a result of throttling the instructions, throttling may be implemented in 3rd droop and thermal design point (TDP). Also, the idle power consumed by the uncore area while the core area is in deep power saving states may be reduced by varying the reference voltage VR and the VP provided to the uncore area. As a result, the idle power consumed by the uncore area may be reduced.

Abstract: Systems and methods for error recovery in an integer execution unit of a multi-core processor are disclosed. In an exemplary embodiment a method may comprise checking parity for a transaction in an execution data path having parallel data registers. The method may also comprise copying one of the parallel data registers to a corrupt data register if parity fails.

Abstract: Systems and methods of sharing processing resources in a multi-threading environment are disclosed. An exemplary method may include allocating a lock value for a resource lock, the lock value corresponding to a state of the resource lock. A first thread may yield at least a portion of the processing resources for another thread. The resource lock may be acquired for the first thread if the lock value indicates the resource lock is available.