Patents by Inventor Don Son

Don Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136263
    Abstract: An electronic package is provided, in which a first electronic module and a second electronic module are stacked via a plurality of first conductive structures and a plurality of second conductive structures, and the amount of solder of the first conductive structures is greater than the amount of solder of the second conductive structures, such that the electronic package can be configured with the first conductive structures and the second conductive structures according to the degree of warpage of the electronic package, so as to effectively disperse the stress to avoid the problem of warpage.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 25, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hung-Kai WANG, Yih-Jenn JIANG, Don-Son JIANG, Yu-Lung HUANG, Men-Yeh CHIANG
  • Patent number: 11903046
    Abstract: A system and method for using a mobile device to capture the proper execution of a series of one or more tasks with pre-assigned constraints that are associated with a specific set of assets is disclosed herein. The assets have certain known physical attributes and characteristics and are configured in a known manner. The assets are preferably vehicles such as trucks.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: February 13, 2024
    Assignee: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky, Emily Stuart, Jacob Fields, Brendan Wood
  • Publication number: 20240049311
    Abstract: A system and method (600) of securely and accurately connecting mobile devices (110) to wireless networks in vehicles (210) for a predetermined work assignment by using encrypted wireless network configurations based on vehicle specific data is disclosed herein. The system comprises a vehicle (210) comprising an on-board computer (232) with a memory (231) having a vehicle identification number (233), a connector plug (235), and an motorized engine (234), a connected vehicle device (130) comprising a processor, a WiFi radio, a BLUETOOTH radio, a memory, and a connector for mating with the connector plug of the vehicle (210), and a mobile device (110) comprising a graphical user interface (335), a processor (310), a WiFi radio (307), a BLUETOOTH radio (306), and a cellular network interface (308).
    Type: Application
    Filed: October 11, 2023
    Publication date: February 8, 2024
    Applicant: Platform Science, Inc.
    Inventors: Scott Kopchinsky, Don Son, John C. Kennedy, Emily Stuart
  • Patent number: 11895714
    Abstract: A system (900) and method (1100) instructing a vehicle (910) where and when to refuel is disclosed herein. The system (900) comprises a server (925) for receiving a workflow for a vehicle (910). The workflow comprises an origination location (901) of the vehicle, a destination (950) of the vehicle (910), a route (905) to the destination, a cargo, a time of departure and a time of arrival. The server (925) determines a plurality of fuel stops (930) along the route (905).
    Type: Grant
    Filed: March 26, 2023
    Date of Patent: February 6, 2024
    Assignee: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky, Emily Stuart
  • Publication number: 20230422319
    Abstract: A system (100) and method (250) for a temporary secure connection between a vehicle device (135) for a vehicle (1000) and wireless authorized network (60) is disclosed herein. The system (100) comprises a vehicle (1000) comprising a vehicle device (135) and a known service provider comprising a physical location (58), a server (56) and a wireless authorized network (60). The vehicle device (135) is configured to initiate an authorized transaction (65), authorized by an assigning authority (1105), for a service (66) over the wireless authorized network (60) with the known service provider (55).
    Type: Application
    Filed: September 6, 2023
    Publication date: December 28, 2023
    Applicant: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky, Matthew Garofalo
  • Publication number: 20230395571
    Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.
    Type: Application
    Filed: August 17, 2023
    Publication date: December 7, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
  • Publication number: 20230361091
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Application
    Filed: July 11, 2023
    Publication date: November 9, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • Patent number: 11812482
    Abstract: A system and method (600) of securely and accurately connecting mobile devices (110) to wireless networks in vehicles (210) for a predetermined work assignment by using encrypted wireless network configurations based on vehicle specific data is disclosed herein. The system comprises a vehicle (210) comprising an on-board computer (232) with a memory (231) having a vehicle identification number (233), a connector plug (235), and an motorized engine (234), a connected vehicle device (130) comprising a processor, a WiFi radio, a BLUETOOTH radio, a memory, and a connector for mating with the connector plug of the vehicle (210), and a mobile device (110) comprising a graphical user interface (335), a processor (310), a WiFi radio (307), a BLUETOOTH radio (306), and a cellular network interface (308).
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: November 7, 2023
    Assignee: Platform Science, Inc.
    Inventors: Scott Kopchinsky, Don Son, John C. Kennedy, Emily Stuart
  • Publication number: 20230354446
    Abstract: A system and method for utilizing data and computational information from on-vehicle and off-vehicle sources. The system comprises an assigning authority engine, a remote profile manager toolset, a plurality of databases, a plurality of cloud sources, a vehicle and a CVD within the vehicle. The dynamic, temporal combinations access data from the plurality of cloud sources comprising third party data and vehicle, timing, event, and/or positioning (“VTEP”) data to inform a plurality of instruction sets delivered by the assigning authority. One or more elements of the VTEP data is used as the basis to synchronize timing between the data, or computational outputs of two or more sources of electronic information. A single coherent information picture is generated from fusing data and computational information from the on-vehicle sources and the off-vehicle sources.
    Type: Application
    Filed: June 7, 2023
    Publication date: November 2, 2023
    Applicant: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky, Jacob Fields, Darrin Demchuk
  • Publication number: 20230307339
    Abstract: An electronic package is provided, and the manufacturing method of which is to form a plurality of conductive pillars and dispose an electronic element on a first circuit structure, then cover the plurality of conductive pillars and the electronic element with a cladding layer, and then form a second circuit structure on the cladding layer, so that the plurality of conductive pillars are electrically connected to the first circuit structure and the second circuit structure, and the electronic element is electrically connected to the first circuit structure, where a fan-out redistribution layer is configured in the first circuit structure and the second circuit structure, and at least one ground layer is configured in the second circuit structure. Further, the ground layer includes a plurality of sheet bodies arranged in an array, so that at least one slot is disposed between every two adjacent sheet bodies.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 28, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ting-Yang Chou, Yih-Jenn Jiang, Don-Son Jiang
  • Patent number: 11769407
    Abstract: A system and method for using a mobile device to capture the proper execution of a series of one or more tasks with pre-assigned constraints that are associated with a specific set of assets, where those assets have certain known physical attributes and characteristics and are configured in a known manner is disclosed herein. The assets are preferably vehicles such as trucks.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: September 26, 2023
    Assignee: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky
  • Publication number: 20230300908
    Abstract: A system and method for micro-navigation of a mobile object (1000) is disclosed herein. Micro-navigation provides guidance to destinations that are not normally found on maps or in navigation systems. In one micro-navigation method, data is collected (1501) related to route transit to specific end points that are not typically mapped. The end points are identified (1502) by relating specific geo coordinates, or physical landmark based characteristics, or electronically described and defined end point to a an identification that will be entered and stored in a location database. Guidance (1503) is provided to vehicles traveling to those end points or destinations, with additional information relevant to a route and/or a specific vehicle and configuration updated and made available to the system.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Applicant: Platform Science, Inc.
    Inventors: John C. Kennedy, Darrin Demchuk, Scott Kopchinsky, Don Son
  • Patent number: 11764188
    Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: September 19, 2023
    Inventors: Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
  • Patent number: 11742296
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: August 29, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • Publication number: 20230268262
    Abstract: A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit layers and the circuit member, where a vertical projected area of the carrier structure is larger than a vertical projected area of the circuit member, such that the circuit member is free from being protruded from side surfaces of the carrier structure. Therefore, the circuit member replaces a part of circuit layers of the carrier structure to reduce the difficulty of fabricating the circuit layers in the carrier structure.
    Type: Application
    Filed: May 23, 2022
    Publication date: August 24, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Li-Chu Chang, Yuan-Hung Hsu, Don-Son Jiang
  • Publication number: 20230232467
    Abstract: A system (900) and method (1100) instructing a vehicle (910) where and when to refuel is disclosed herein. The system (900) comprises a server (925) for receiving a workflow for a vehicle (910). The workflow comprises an origination location (901) of the vehicle, a destination (950) of the vehicle (910), a route (905) to the destination, a cargo, a time of departure and a time of arrival. The server (925) determines a plurality of fuel stops (930) along the route (905).
    Type: Application
    Filed: March 26, 2023
    Publication date: July 20, 2023
    Applicant: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky, Emily Stuart
  • Patent number: 11706822
    Abstract: A system and method for utilizing data and computational information from on-vehicle and off-vehicle sources. The system comprises an assigning authority engine, a remote profile manager toolset, a plurality of databases, a plurality of cloud sources, a vehicle and a CVD within the vehicle. The dynamic, temporal combinations access data from the plurality of cloud sources comprising third party data and vehicle, timing, event, and/or positioning (“VTEP”) data to inform a plurality of instruction sets delivered by the assigning authority. One or more elements of the VTEP data is used as the basis to synchronize timing between the data, or computational outputs of two or more sources of electronic information. A single coherent information picture is generated from fusing data and computational information from the on-vehicle sources and the off-vehicle sources.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: July 18, 2023
    Assignee: Platform Science, Inc.
    Inventors: John C. Kennedy, Don Son, Scott Kopchinsky, Jacob Fields, Darrin Demchuk
  • Publication number: 20230224980
    Abstract: A system and method (600) of securely and accurately connecting mobile devices (110) to wireless networks in vehicles (210) for a predetermined work assignment by using encrypted wireless network configurations based on vehicle specific data is disclosed herein. The system comprises a vehicle (210) comprising an on-board computer (232) with a memory (231) having a vehicle identification number (233), a connector plug (235), and an motorized engine (234), a connected vehicle device (130) comprising a processor, a WiFi radio, a BLUETOOTH radio, a memory, and a connector for mating with the connector plug of the vehicle (210), and a mobile device (110) comprising a graphical user interface (335), a processor (310), a WiFi radio (307), a BLUETOOTH radio (306), and a cellular network interface (308).
    Type: Application
    Filed: March 8, 2023
    Publication date: July 13, 2023
    Applicant: Platform Science, Inc.
    Inventors: Scott Kopchinsky, Don Son, John C. Kennedy, Emily Stuart
  • Patent number: 11696349
    Abstract: A system and method for micro-navigation of a mobile object (1000) is disclosed herein. Micro-navigation provides guidance to destinations that are not normally found on maps or in navigation systems. In one micro-navigation method, data is collected (1501) related to route transit to specific end points that are not typically mapped. The end points are identified (1502) by relating specific geo coordinates, or physical landmark based characteristics, or electronically described and defined end point to a an identification that will be entered and stored in a location database. Guidance (1503) is provided to vehicles traveling to those end points or destinations, with additional information relevant to a route and/or a specific vehicle and configuration updated and made available to the system.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: July 4, 2023
    Assignee: Platform Science, Inc.
    Inventors: John C. Kennedy, Darrin Demchuk, Scott Kopchinsky, Don Son
  • Publication number: 20230187382
    Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 15, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang