Patents by Inventor Don-Son Jiung

Don-Son Jiung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    Publication number: 20100297842
    Abstract: A conductive bump structure for a semiconductor device and a method for fabricating the same are provided. A metal bump is formed on an under bump metallurgy (UBM) structure electrically connected to and formed on a connection pad of the semiconductor device, wherein the metal bump is sized smaller than the UBM structure. Subsequently, a solder bump is mounted on the UBM structure and encapsulates the metal bump, so as to increase the bonding area and simultaneously allow the solder bump to be sufficiently wetted on the UBM structure to enhance bonding stress of the solder bump.
    Type: Application
    Filed: August 6, 2010
    Publication date: November 25, 2010
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chun Chi KE, Chien-Ping HUANG, Don-Son JIUNG, Yu-Po WANG
  • Conductive bump structure for semiconductor device and fabrication method thereof
    Publication number: 20060246706
    Abstract: A conductive bump structure for a semiconductor device and a method for fabricating the same are provided. A metal bump is formed on an under bump metallurgy (UBM) structure electrically connected to and formed on a connection pad of the semiconductor device, wherein the metal bump is sized smaller than the UBM structure. Subsequently, a solder bump is mounted on the UBM structure and encapsulates the metal bump, so as to increase the bonding area and simultaneously allow the solder bump to be sufficiently wetted on the UBM structure to enhance bonding stress of the solder bump.
    Type: Application
    Filed: April 12, 2006
    Publication date: November 2, 2006
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chun Chi Ke, Chien-Ping Huang, Don-Son Jiung, Yu-Po Wang