Abstract: A printed circuit assembly, along with a server and method incorporating such printed circuit assembly, are disclosed for determining a storage configuration for use in a computer system via a simple hardware change. The printed circuit assembly may comprise a paddle board slot for connection to a paddle board for determining a storage configuration; a bus coupled to the paddle board; and a southbridge coupled to the bus, the southbridge comprising signal lines coupled to the paddle board slot through the bus. The storage configuration of the printed circuit assembly may be determined via the paddle board when the paddle board is connected to the paddle board slot.

Abstract: A printed circuit assembly, along with a server and method incorporating such printed circuit assembly, are disclosed for determining a storage configuration for use in a computer system via a simple hardware change. The printed circuit assembly may comprise a paddle board slot for connection to a paddle board for determining a storage configuration; a bus coupled to the paddle board; and a southbridge coupled to the bus, the southbridge comprising signal lines coupled to the paddle board slot through the bus. The storage configuration of the printed circuit assembly may be determined via the paddle board when the paddle board is connected to the paddle board slot.

Abstract: An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB within the housing to define a substantially enclosed upper chamber above the lower chamber. The second PCB includes one or more airflow apertures defined therethrough and providing vertical air flow coupling between the upper and lower chambers. An airflow actuating device is utilized to generate a primary forced airflow within the upper chamber which is substantially parallel to the surface plane of the second PCB. The primary forced airflow further induces a negative air pressure in the upper chamber such that a mixed convection airflow is established between the upper and lower chambers via the second PCB apertures.

Abstract: A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.

Abstract: A computing system with a SCSI controller includes SCSI transmission mode selection apparatus and method to switch the transmission line drivers between transmitting in SCSI 1, SCSI 2 or another mode. The controller selects a maximum data transmission rate compatible with each peripheral device connected to the controller. A user-defined option code is decoded by the controller to provide the user with control over transmission mode options for the drivers in the controller. Based on the data transmission rate and the selected option, the controller selects the SCSI transmission mode to use for each driver type, acknowledge line or data lines.