Abstract: A composition having a compound having the structure: wherein each R is an independently selected alkylphenol-free moiety that is a C1-20 alkyl, C2-22 alkenyl, C6-40 cycloalkyl, C7-40 cycloalkylene, C3-20 methoxy alkyl glycol ether, C3-20 alkyl glycol ether, or Y—OH moiety; wherein each Y is an independently selected alkylphenol-free moiety that is a C2-40 alkylene, C7-40 cycloalkylene, or C3-40 alkyl lactone moiety; wherein m is an integer ranging from 1 to 100; and wherein x is an integer ranging from 1 to 1000.

Abstract: A composition having a film having linear low density polyethylene and a first antioxidant component that is: wherein each R moiety is independently selected and is a C8-C20 alkyl moiety.

Abstract: A composition having a compound having the structure: wherein each R is an independently selected alkylphenol-free moiety that is a C1-20 alkyl, C2-22 alkenyl, C6-40 cycloalkyl, C7-40 cycloalkylene, C3-20 methoxy alkyl glycol ether, C3-20 alkyl glycol ether, or Y—OH moiety; wherein each Y is an independently selected alkylphenol-free moiety that is a C2-40 alkylene, C7-40 cycloalkylene, or C3-40 alkyl lactone moiety; wherein m is an integer ranging from 1 to 100; and wherein x is an integer ranging from 1 to 1000.

Abstract: A composition having polyvinylchloride; and a chlorinated ester having the chemical structure: wherein R1 is a C6-22 chlorinated-hydrocarbon moiety, wherein R2 is a C1-C18 hydrocarbon moiety, wherein n is 1, 2, 3, or 4, wherein if n is greater than 1, each R1 is the same or different; and wherein the chlorinated ester is 15-70% by weight chlorine; wherein the chlorinated ester is a product of a process that uses fatty-acid-ester reactants having less than two C?C double bonds; and wherein the chlorinated ester is a product of a process that does not use fatty-acid-ester reactants having two or more C?C double bonds.

Abstract: A lubricant composition having the non-water reaction products produced by a process having the step of reacting the following-three reactants in a condensation reaction: i) oleic acid, ii) triethanolamine, and iii) a polyol selected from the group consisting of pentaerythritol and trimethylolpropane.

Abstract: A composition having polyvinylchloride; and a chlorinated ester having the chemical structure: wherein R1 is a C6-22 chlorinated-hydrocarbon moiety, wherein R2 is a C1-C18 hydrocarbon moiety, wherein n is 1, 2, 3, or 4, wherein if n is greater than 1, each R1 is the same or different; and wherein the chlorinated ester is 15-70% by weight chlorine; wherein the chlorinated ester is a product of a process that uses fatty-acid-ester reactants having less than two C?C double bonds; and wherein the chlorinated ester is a product of a process that does not use fatty-acid-ester reactants having two or more C?C double bonds.

Abstract: A drilling-fluid composition having an oil-based mud, water-based mud, or synthetic-based mud; and a fluid lubricant having a pour point ranging from ?5° C. to ?30° C., the fluid lubricant having a sulfurized fatty ester, a sulfurized olefin, or a combination thereof, wherein the sulfurized fatty ester is 5 to 15% by weight sulfur and selected from the group consisting of sulfurized biodiesel; sulfurized methyl oleate, and sulfurized methyl esters derived from vegetable oil, wherein the sulfurized olefin is 5 to 15% by weight sulfur and selected from the group consisting of sulfurized alpha or internal olefins ranging from C8 to C18; and the fluid lubricant being present in the composition in an amount ranging from 0.1 to 10% by weight.

Abstract: A composition having a polymeric ester having the formula: wherein each R is the same or different and independently selected from the group consisting of H, C1-20 alkyl carboxylate, C3-22 alkenyl carboxylate, C6-40 cycloalkyl carboxylate, and C6-40 cycloalkylene carboxylate; R2 is selected from the group consisting of C1-20 alkyl, C3-22 alkenyl, C6-40 cycloalkyl, and C6-40 cycloalkylene; and at least one polymer additive.

Abstract: The invention generally relates to various aspects of a plasma process and, more specifically, to the monitoring of such plasma processes. One aspect relates to a plasma monitoring module that may be adjusted in at least some manner so as to re-evaluate a previously monitored plasma process. For instance, optical emissions data on a plasma process that was previously monitored by the plasma monitoring module may be replayed through the plasma monitoring module after making at least one adjustment in relation to the plasma monitoring module.

Abstract: The present invention relates to a method and assembly for leak detection in a plasma system. The invention can accomplish not only leak detection, but also leak location while maintaining a plasma within the plasma system. Leak detection for the invention is achieved by obtaining spectral data of the plasma at one or more times while maintaining the plasma within the plasma system and comparing the same to predetermined spectral data of air. Upon a determination that air is present within the plasma system, one or more external surfaces of the plasma system are exposed to a test gas and the spectral data of the plasma is analyzed after each exposure to determine if the test gas is present in the system. If the test gas is present, a determination can be made that the particular external surface to which the test gas was applied is a leak location.

Abstract: The present invention relates to a method and assembly for leak detection in a plasma system. The invention can accomplish not only leak detection, but also leak location while maintaining a plasma within the plasma system. Leak detection for the invention is achieved by obtaining spectral data of the plasma at one or more times while maintaining the plasma within the plasma system and comparing the same to predetermined spectral data of air. Upon a determination that air is present within the plasma system, one or more external surfaces of the plasma system are exposed to a test gas and the spectral data of the plasma is analyzed after each exposure to determine if the test gas is present in the system. If the test gas is present, a determination can be made that the particular external surface to which the test gas was applied is a leak location.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.