Abstract: A method for cooling a transformer and transformer apparatuses are implemented. A transformer apparatus, according to one embodiment, comprises: a conduction cooled electrical transformer (240) mounted to a cold plate (252); and a heat pipe (262) for supplementing cooling of the transformer (240), the heat pipe (262) comprising a first end (303), a second end (305), and a sealed low pressure cavity containing an amount of a fluid (311), wherein the first end (303) of the heat pipe (262) is located in a hot region of the transformer (240), the second end (305) is maintained colder than the first end (303) by contact with the cold plate (252), and heat produced at the first end (303) by operation of the transformer (240) is moved to the second end (305) by a closed loop vapor cycle in the sealed low pressure cavity using the fluid (311) of the heat pipe (262).

Abstract: A semiconductor power device, e.g., an Insulated Gate Bi-polar Transistor (IGBT) or a Metal-Oxide Field Effect Transistor (MOSFET) may be constructed in a reusable and repairable cost-effective sealed shell. The switch may be provided with direct-pressure-contact caps which may perform as electrical conductors for a semiconductor die of the switch and also as thermal heat-sink contacts for the device. The switch may be provided with internal self-powered gate driving control and PHM incorporated in sealed shell. Embodiments of the switch may be constructed with no external gating/PHM connection pin penetrations through the shell.

Abstract: An electrical distribution control system for a vehicle such as an aircraft may be provided fire-suppression protection without requiring that all control elements are located in a fire-containment enclosure. A primary electric load center (ECL) may be located in a fire-containment equipment bay. Secondary power control centers (SPC's) may be located away from the equipment bay and close to set of loads which are controlled by the SPC's. Each SPC may be provided with a fire detecting sensor that may signal the ECL to interrupt input power to the SPC in the event of a fire in the SPC. The SPC may be constructed from self-extinguishing material. In an absence of input power to the SPC, a fire may self extinguish, thus preventing flame propagation or production of excessive external heat.

Abstract: A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.

Abstract: An electrical distribution control system for a vehicle such as an aircraft may be provided fire-suppression protection without requiring that all control elements are located in a fire-containment enclosure. A primary electric load center (ECL) may be located in a fire-containment equipment bay. Secondary power control centers (SPC's) may be located away from the equipment bay and close to set of loads which are controlled by the SPC's. Each SPC may be provided with a fire detecting sensor that may signal the ECL to interrupt input power to the SPC in the event of a fire in the SPC. The SPC may be constructed from self-extinguishing material. In an absence of input power to the SPC, a fire may self extinguish, thus preventing flame propagation or production of excessive external heat.

Abstract: A semiconductor power device, e.g., an Insulated Gate Bi-polar Transistor (IGBT) or a Metal-Oxide Field Effect Transistor (MOSFET) may be constructed in a reusable and repairable cost-effective sealed shell. The switch may be provided with direct-pressure-contact caps which may perform as electrical conductors for a semiconductor die of the switch and also as thermal heat-sink contacts for the device. The switch may be provided with internal self-powered gate driving control and PHM incorporated in sealed shell. Embodiments of the switch may be constructed with no external gating/PHM connection pin penetrations through the shell.

Abstract: A method for cooling a transformer and transformer apparatuses are implemented. A transformer apparatus, according to one embodiment, comprises: a conduction cooled electrical transformer (240) mounted to a cold plate (252); and a heat pipe (262) for supplementing cooling of the transformer (240), the heat pipe (262) comprising a first end (303), a second end (305), and a sealed low pressure cavity containing an amount of a fluid (311), wherein the first end (303) of the heat pipe (262) is located in a hot region of the transformer (240), the second end (305) is maintained colder than the first end (303) by contact with the cold plate (252), and heat produced at the first end (303) by operation of the transformer (240) is moved to the second end (305) by a closed loop vapor cycle in the sealed low pressure cavity using the fluid (311) of the heat pipe (262).