Abstract: A heat sink includes a base (20) and a number of fins (30). The base includes a bottom plate (21) to be positioned on and in contact with an electronic package, such as a central processing unit, and a column (22) extending from the bottom plate opposite the electronic package. The fins are attached to the column and radially extend therefrom. A gap is formed between the fins and the plate of the base for facilitating air flow through the heat sink. A curved surface (23) may be formed between the column and the base for guiding the air flow away from the fins.