Patents by Inventor Donald A. Girard, Jr.

Donald A. Girard, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210391673
    Abstract: A cable assembly comprising a termination with at least one conductive, compressible member and a conductive ground shield. The conductive, compressible member may be held within a connector module forming the termination such that the conductive compressive member is pressed against, and therefore makes electrical contact with, both an outer conductive layer of the cable and ground structures within the connector module. In some embodiments, these connections may be formed using a conductive, compressible member with an opening configured to receive the end of the cable therethrough. The conductive ground shield may be configured to compress the conductive, compressible member, and to cause the conductive, compressible member to electrically contact the cable's conductive layer. The conductive, compressible member may be formed from a compressible material and may comprise a plurality of conductive particulates configured to provide electrically conductive paths.
    Type: Application
    Filed: April 26, 2021
    Publication date: December 16, 2021
    Applicant: Amphenol Corporation
    Inventors: Donald A. Girard, JR., David Manter, Vysakh Sivarajan
  • Publication number: 20210359450
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Application
    Filed: July 30, 2021
    Publication date: November 18, 2021
    Applicant: Amphenol Corporation
    Inventors: Donald A. Girard, JR., Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine
  • Publication number: 20210315102
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 7, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Patent number: 11057995
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 6, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Publication number: 20210175670
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 10, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Patent number: 10992086
    Abstract: A cable assembly comprising a termination with at least one conductive, compressible member and a conductive ground shield. The conductive, compressible member may be held within a connector module forming the termination such that the conductive compressive member is pressed against, and therefore makes electrical contact with, both an outer conductive layer of the cable and ground structures within the connector module. In some embodiments, these connections may be formed using a conductive, compressible member with an opening configured to receive the end of the cable therethrough. The conductive ground shield may be configured to compress the conductive, compressible member, and to cause the conductive, compressible member to electrically contact the cable's conductive layer. The conductive, compressible member may be formed from a compressible material and may comprise a plurality of conductive particulates configured to provide electrically conductive paths.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: April 27, 2021
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Jr., David Manter, Vysakh Sivarajan
  • Publication number: 20210091496
    Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Donald A. Girard, JR., Eric Leo
  • Publication number: 20210083434
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, JR., Donald A. Girard, JR.
  • Patent number: 10855034
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 1, 2020
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, Jr., Donald A. Girard, Jr.
  • Patent number: 10847937
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: November 24, 2020
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Patent number: 10840649
    Abstract: A high speed, high density connector has an organizer. Contact tails of the connector pass through the organizer. The organizer has an insulative body. Portions of the organizer are selectively made more conductive by plating on the body. Those plated portions electrically connect contact tails of ground conductors passing through the organizer. The plated portions are lossy or conductive.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: November 17, 2020
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, Jr., Donald A. Girard, Jr.
  • Publication number: 20200259297
    Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion. Broadside coupling provides balanced pairs for very high frequency operation. The connector may be assembled with multiple subassemblies, each of which may have multiple pairs of signal conductors. The subassemblies may be formed from an insulative portion having grooves in opposite sides into which the intermediate portions of signal conductors. Covers, holding the signal conductors in the grooves, may establish the position of the signal conductors relative to reference conductors at the exterior of subassembly, so as to provide a controlled impedance. Lossy material may be positioned between the pairs in a subassembly and/or may contact the reference conductors of the subassemblies, and the lossy material of the subassemblies may in turn be connected with a conductive structure.
    Type: Application
    Filed: April 24, 2020
    Publication date: August 13, 2020
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., Brian Kirk, David Levine, Vysakh Sivarajan
  • Patent number: 10720724
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: July 21, 2020
    Assignee: Amphenol Corporation
    Inventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine, Donald A. Girard, Jr.
  • Patent number: 10707626
    Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 7, 2020
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., Brian Kirk, David Levine, Vysakh Sivarajan
  • Patent number: 10673183
    Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: June 2, 2020
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., Brian Kirk, David Levine, Vysakh Sivarajan
  • Patent number: 10617027
    Abstract: An adapter has two conductors each with a U-shaped bend forming upper longer legs and lower shorter legs. The conductors face each other with the longer legs linearly aligned with each other and the shorter legs aligned with each other, thereby forming a first gap between the longer legs and a second gap between the shorter legs. The first gap is substantially smaller than the second gap, so that an electrical package can be placed across the first gap to contact the two upper longer legs, while the two shorter legs are spaced further apart to span a larger gap between conductors of a connector. Thus, the adapter enables the electrical package to be connected to conductors having a gap that is larger than the electrical package.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 7, 2020
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Jr., Robert Auger, Mark W. Gailus
  • Publication number: 20190380204
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: June 10, 2019
    Publication date: December 12, 2019
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Publication number: 20190334292
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: July 8, 2019
    Publication date: October 31, 2019
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20190260147
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Applicant: Amphenol Corporation
    Inventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine, Donald A. Girard, JR.
  • Publication number: 20190252832
    Abstract: A cable assembly comprising a termination with at least one conductive, compressible member and a conductive ground shield. The conductive, compressible member may be held within a connector module forming the termination such that the conductive compressive member is pressed against, and therefore makes electrical contact with, both an outer conductive layer of the cable and ground structures within the connector module. In some embodiments, these connections may be formed using a conductive, compressible member with an opening configured to receive the end of the cable therethrough. The conductive ground shield may be configured to compress the conductive, compressible member, and to cause the conductive, compressible member to electrically contact the cable's conductive layer. The conductive, compressible member may be formed from a compressible material and may comprise a plurality of conductive particulates configured to provide electrically conductive paths.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Applicant: Amphenol Corporation
    Inventor: Donald A. Girard, JR.