Patents by Inventor Donald A. Machusak

Donald A. Machusak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermocompression bonding of copper leads to a metallized ceramic substrate
    Patent number: 4734753
    Abstract: Copper leads having an average grain size from 0.035 to 0.055 mm are thermocompression bonded to a metallized portion of a ceramic substrate. Surprisingly, such large grain size substantially decreases the "ceramic pullout" of the bonded leads.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: March 29, 1988
    Assignees: American Telephone and Telegraph Company, AT&T Technologies, Inc.
    Inventors: Benjamin H. Cranston, Richard L. Hunsberger, Donald A. Machusak
  • Method of forming a laminate
    Patent number: RE29879
    Abstract: A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film against the surface to shear a portion of the film, corresponding in shape to the surface, away from the buffer medium to bond the sheared portion to the surface.
    Type: Grant
    Filed: September 30, 1977
    Date of Patent: January 16, 1979
    Assignee: Western Electric Company, Inc.
    Inventors: Benjamin H. Cranston, Carl F. Hornig, Donald A. Machusak