Abstract: The method includes locating a target on a printed circuit board laminate having a circuit pattern etched thereon and utilizing the target to locate the laminate in a punching device. Preferably two such targets are employed and the laminate is adjusted in the X and Y directions as well as rotationally to bring the target into prescribed relationship with reference markings whereby to locate the holes precisely in the laminate whereby to facilitate stacking of the same. In related apparatus two television cameras are employed to operate with two targets to feed data into a microprocessor which generates signals to cause an alignment of the laminate to be punched. With respect to punching mechanisms special techniques are employed to locate the centers of the targets so that these centers can be aligned with cross hairs to take into account the deviations possible in the configurations of the targets.