Abstract: Systems and methods according to aspects of the present invention are described. The systems and methods enable charging, soaking, and measuring of capacitors to be conducted quickly. Charging and soaking typically occurs in parallel and certain embodiments facilitate the measuring of capacitor leakage by sequentially disconnecting each capacitor and measuring the time for voltage on the capacitor to reach a predetermined threshold. Further, all capacitors can be disconnected from a charging source simultaneously and voltages can be measured for each capacitor simultaneously. Monitoring can be periodic in nature. Substantial time savings in the calculation device of leakage values and parameters can be attained.

Abstract: Systems and methods according to aspects of the present invention are described. The systems and methods enable charging, soaking, and measuring of capacitors to be conducted quickly. Charging and soaking typically occurs in parallel and certain embodiments facilitate the measuring of capacitor leakage by sequentially disconnecting each capacitor and measuring the time for voltage on the capacitor to reach a predetermined threshold. Further, all capacitors can be disconnected from a charging source simultaneously and voltages can be measured for each capacitor simultaneously. Monitoring can be periodic in nature. Substantial time savings in the calculation device of leakage values and parameters can be attained.

Abstract: A stereoscopic three-dimensional optical metrology system and method accurately measure the location of physical features on a test article in a manner that is fast and robust to surface contour discontinuities. Disclosed embodiments may image a test article from two or more perspectives through a substantially transparent fiducial plate bearing a fiducial marking; camera viewing angles and apparent relative distances between a feature on a test article and one or more fiducials may enable accurate calculation of feature position.

Abstract: A stereoscopic three-dimensional optical metrology system and method accurately measure the location of physical features on a test article in a manner that is fast and robust to surface contour discontinuities. Disclosed embodiments may image a test article from two or more perspectives through a substantially transparent fiducial plate bearing a fiducial marking; camera viewing angles and apparent relative distances between a feature on a test article and one or more fiducials may enable accurate calculation of feature position.

Abstract: A probe card inspection system uses a fiduciary plate having a plurality of targets deposited thereon by photolithography and vapor deposition. A plurality of semiconductor probe card probe tips are contacted with the fiducial pattern on the plate. An electronic imaging system determines the position of geometric centroids of the probe tips with respect to an index mark in the fiducial pattern. A central processor determines the position of each imaged probe tip(s) with respect to the index mark, and calculates the relative positions of each probe tip from that data.

Abstract: A stereoscopic three-dimensional optical metrology system and method accurately measure the location of physical features on a test article in a manner that is fast and robust to surface contour discontinuities. Disclosed embodiments may image a test article from two or more perspectives through a substantially transparent fiducial plate bearing a fiducial marking; camera viewing angles and apparent relative distances between a feature on a test article and one or more fiducials may enable accurate calculation of feature position.

Abstract: A high precision, small volume fluid processing system employs open ended capillary tubes to meter, aliquot and mix small volumes of sample fluid and reagents. The system has an automatic mechanism for moving the capillary tubes as well as automated sub-systems for incubating and mixing fluids within the capillary tubes.

Abstract: A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.

Abstract: A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.

Abstract: A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.