Patents by Inventor Donald Bitting

Donald Bitting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
    Publication number: 20070069394
    Abstract: The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
    Type: Application
    Filed: July 21, 2006
    Publication date: March 29, 2007
    Applicant: Agere Systems Inc.
    Inventors: Mark Bachman, Donald Bitting, Sailesh Chittipeddi, Seung Kang, Sailesh Merchant
  • Optical polymer nanocomposite substrates with surface relief structures
    Publication number: 20030180029
    Abstract: A solid substrate comprising a first major surface, a second major surface juxtaposed from and parallel or substantially parallel to the first major surface, wherein the substrate has a plurality of surface relief structures, located on the substrate between the first and second major surfaces, and extending over the substrate; wherein the solid substrate comprises a host matrix, and at least one nanoparticle within the host matrix.
    Type: Application
    Filed: March 17, 2003
    Publication date: September 25, 2003
    Inventors: Anthony F. Garito, Yu-Ling Hsiao, Renyuan Gao, Renfeng Gao, Joseph Chang, Donald Bitting, Kazuya Takayama, Jaya Sharma, Jingsong Zhu, Brian Thomas, Anna Panackal