Abstract: Damage to and short circuiting of bond fingers on a substrate due to die-attach resin bleed is prevented, thereby increasing yield and improving reliability. Embodiments include forming a trough in a solder mask on a substrate between the bond fingers and semiconductor chip to prevent the die-attach resin from reaching the bond fingers.

Abstract: Stacked die assemblies and modules are fabricated by a process wherein discrete first and second, very thin semiconductor IC dies or chips are adhesively bonded together to form a mechanically robust stacked die assembly. A plurality of stacked die assemblies are then adhesively bonded to a substrate, e.g., a circuit board, electrically contacted, and encapsulated in a suitable pottant material. The formation of mechanically robust stacked die assemblies prior rather than subsequent to bonding to the substrate effectively minimizes fracture or other damage to the very thin and fragile semiconductor dies or chips resulting from non-planarity of the substrate surface and/or non-uniformity of adhesive layer thickness.