Abstract: Injection molded ring fan embodiments and methods for making them. The methods influence material flow during the injection molding process such that a major portion of the materials flowing in opposite directions in the outer rings preferably flow past one another, intermix in a swirling relationship, and/or collide at an angle relative to one another. This results in better material mixing or integration of the flow fronts. In one embodiment, the thickness of the outer ring varies in different portions between adjacent fan blades.

Abstract: A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).

Abstract: An encapsulant composition is provided. The composition includes an epoxy composition including at least two siloxane repeat units and a curing agent. The encapsulant composition is particularly suited for encapsulating light emitting diode components.

Abstract: A method to influence material flow during the injection molding of thermoplastic, polymeric ring type fans such that a major portion of the materials flowing in opposite directions preferably flow past one another, or collide at an angle relative to one another, rather than colliding at an 180 degree angle relative to each other to form weld lines. This flow bypassing results in better material mixing or integrating than merely allowing flow fronts to collide and cool. In one embodiment, a portion of the fan's ring is thickened in the weld line area to minimize the amount of material colliding at a 180-degree angle relative to each. Alternatively, at least one appendage could be added to the ring fan that will influence the material flow during molding conditions. Each appendage will be removed prior to introducing the ring fan to a cooling system.

Abstract: A light emitting device comprised of a light emitting diode on a mounting surface, the light emitting diode includes a substrate layer and at least one active region. A resilient substantially transparent and substantially phosphor free polymer layer extends from the mounting surface to above at least one quarter of a height of the substrate layer but below a top surface of the light emitting diode. A second phosphor containing layer extends from the phosphor free polymer layer to above the top surface of the light emitting diode.

Abstract: Apparatus for compressing tissue to be scanned for medical imaging is provided. The apparatus may comprise a compression membrane and a tensioning apparatus coupled to the membrane to apply a tensile force to the membrane to place the membrane in a taut condition during an imaging process. In one exemplary application that combines ultrasound scanning with X-ray mammography, the compressing apparatus enables accurate, reproducible ultrasound images reducing distortion and attenuation, which may otherwise be introduced as a consequence of such a combination of imaging processes.

Abstract: A lens and encapsulant made of an amorphous fluoropolymer for a light-emitting diode (LED) or diode laser, such as an ultraviolet (UV) LED (UVLED). A semiconductor diode die (114) is formed by growing a diode (110) on a substrate layer (115) such as sapphire. The diode die (114) is flipped so that it emits light (160, 365) through the face (150) of the layer (115). An amorphous fluoropolymer encapsulant encapsulates the emitting face of the diode die (114), and may be shaped as a lens to form an integral encapsulant/lens. Or, a lens (230, 340) of amorphous fluoropolymer may be joined to the encapsulant (220). Additional joined or separate lenses (350) may also be used. The encapsulant/lens is transmissive to UV light as well as infrared light. Encapsulating methods are also provided.

Abstract: A light emitting device comprised of a light emitting diode on a mounting surface, the light emitting diode includes a substrate layer and at least one active region. A resilient substantially transparent and substantially phosphor free polymer layer extends from the mounting surface to above at least one quarter of a height of the substrate layer but below a top surface of the light emitting diode. A second phosphor containing layer extends from the phosphor free polymer layer to above the top surface of the light emitting diode.