Patents by Inventor Donald C. Discher

Donald C. Discher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11362432
    Abstract: A radio frequency (RF) aperture includes an interface printed circuit board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. Chip baluns are mounted on the back side of the interface printed circuit board. Each chip balun has a balanced port electrically connected with two neighboring electrically conductive tapered projections via electrical feedthroughs passing through the interface printed circuit board. Each chip balun further has an unbalanced port, and RF circuitry disposed at the back side of the interface printed circuit board is electrically connected with the unbalanced ports of the chip baluns. The electrically conductive tapered projections include dielectric tapered projections and an electrically conductive layer disposed on an inner or outer surface of the dielectric tapered projections.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: June 14, 2022
    Assignee: Battelle Memorial Institute
    Inventors: Daniel A. Perkins, Daniel G. Loesch, Donald C. Discher, Raphael Joseph Welsh
  • Publication number: 20200343645
    Abstract: A radio frequency (RF) aperture includes an interface printed circuit board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. Chip baluns are mounted on the back side of the interface printed circuit board. Each chip balun has a balanced port electrically connected with two neighboring electrically conductive tapered projections via electrical feedthroughs passing through the interface printed circuit board. Each chip balun further has an unbalanced port, and RF circuitry disposed at the back side of the interface printed circuit board is electrically connected with the unbalanced ports of the chip baluns. The electrically conductive tapered projections include dielectric tapered projections and an electrically conductive layer disposed on an inner or outer surface of the dielectric tapered projections.
    Type: Application
    Filed: April 24, 2020
    Publication date: October 29, 2020
    Inventors: Daniel A. Perkins, Daniel G. Loesch, Donald C. Discher, Raphael Joseph Welsh