Abstract: An improved squeegee for screen printing a thick film ink onto a substrate of a microelectronics circuit in order to form a thick film on the substrate. The squeegee is specifically configured to eliminate the creation of voids in a thick film deposited using the squeegee by enhancing the flow characteristics of the thick film ink as it is forced through a printing screen by the squeegee. Improved flow characteristics are achieved be appropriately configuring the cross-sectional profile of the squeegee in order to localize the printing forces on the ink at the working edge of the squeegee, in order to prevent ink ahead of the working edge from prematurely filling the openings in the screen.

Abstract: Disclosed is an apparatus and method of through hole substrate printing wherein the apparatus includes a nest plate having a plurality of vacuum source holes formed therein of a size substantially greater than the through holes in the substrate, and a plurality of removable pointed pins supporting the substrate in a substantially flat and horizontal position during the printing operation. The removably pointed pins allow for the flexibility of printing a variety of conductive patterns for different substrates and without the risk of breaking the substrate or smearing the conductive pattern on the bottom surface of the substrate or the subsequent substrate to be printed.