Abstract: A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system.

Abstract: A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system.

Abstract: Foamed in place polymer compositions are made from monomer-in-polymer solutions containing free radical polymerization catalysts and foaming agents.

Abstract: Adhesive compositions are made from methacrylate ester monomers, elastomeric polymers having a Tg below -25.degree. C. and which are soluble in the monomers, core-shell polymers which swell in the monomers but do not dissolve therein, and free radical producing catalysts. These adhesive compositions when used in bonded assemblies exhibit a combination of high adhesive bond impact strength and high bulk tensile elongation.

Abstract: Adhesive compositions are made from methacrylate ester monomers, elastomeric polymers having a Tg below -25.degree. C. and which are soluble in the monomers, core-shell polymers which swell in the monomers but do not dissolve therein, and free radical producing catalysts. These adhesive compositions when used in bonded assemblies exhibit a combination of high adhesive bond impact strength and high bulk tensile elongation.

Abstract: It has been discovered that by adding one or more strong organic carboxylic acids to conventional acrylate and/or methacrylate based adhesive compositions, the bonding characteristics thereof change dramatically.Thermoplastic materials whose bondability is most dramatically enhanced by the compositions of the present invention are nylon and blends of nylon and nylon-like materials with other polymers.Thermoset materials which exhibit dramatically enhanced bondability comprise homogeneous materials such as epoxies, and composite materials such as polyesters, urethanes, and/or epoxies, containing glass, minerals, and the like, which are polar or have hydrogen bonding capability.The present invention thus utilizes acrylate and/or methacrylate based adhesive compositions as a base material. To this base material is added an effective amount of one or more strong organic carboxylic acids, e.g., acids having a relatively high dissociation constant (K.sub.d or K.sub.ld).

Abstract: Adhesive compositions are made from methacrylate ester monomers, elastomeric polymers having a Tg below -25.degree. C. and which are soluble in the monomers, core-shell polymers which swell in the monomers but do not dissolve therein, and free radical producing catalysts. These adhesive compositions when used in bonded assemblies exhibit a combination of high adhesive bond impact strength and high bulk tensile elongation.

Abstract: It has been discovered that by adding one or more strong organic carboxylic acids to conventional acrylate and/or methacrylate based adhesive compositions, the bonding characteristics thereof change dramatically.Thermoplastic materials whose bondability is most dramatically enhanced by the compositions of the present invention are nylon and blends of nylon and nylon-like materials with other polymers.Thermoset materials which exhibit dramatically enhanced bondability comprise homogeneous materials such as epoxies, and composite materials such as polyesters, urethanes, and/or epoxies, containing glass, minerals, and the like, which are polar or have hydrogen bonding capability.The present invention thus utilizes acrylate and/or methacrylate based adhesive compositions as a base material. To this base material is added an effective amount of one or more strong organic carboxylic acids, e.g., acids having a relatively high dissociation constant (K.sub.d or K.sub.1d).