Abstract: An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads.

Abstract: An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads.

Abstract: An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads.

Abstract: A 2,356 base pair fragment isolated from the human X chromosome, designated as Xrep, has been found to exert a positive effect on plasmid replication in both prokaryotic and eukaryotic cells. The Xrep, in addition, has been found to increase transcription of DNA, thus leading to increased expression of desired protein products. The Xrep segment has been fully sequenced and portions thereof have been found to exhibit homologies with enhancer sequences contained in various viruses.

Abstract: A side view mirror assembly having a housing and a spring biased mirror installed within the housing, the mirror having its reflecting surface facing outwardly of the housing, and a mirror orientation adjusting assembly including a pair of nested hemispheres detachably engaged for limited movement one relative to the other, one of said hemispheres having the mirror secured thereto, a clamp including a high strength spring arranged to immobilize said hemispheres in an effectively locked condition, and an electromagnet disposed when energized to reduce the effective force of the spring on the clamp so as to permit limited movement of the mirror carrying hemisphere for adjusting the orientation thereof. A suitable switch is coupled between the electromagnet and the vehicle battery, the ignition switch of the vehicle being interposed between said first mentioned switch and the vehicle battery.

Abstract: A multi-function turn signal switch comprises a cylindrical switch body on which an operating lever is mounted for pivotal motion about a pivot located on the longitudinal axis of the body. Located internally of the body on a transverse end wall through which the lever passes, is a circular array of four sealed membrane switches, arranged at 90 degree intervals about the longitudinal axis. The lever is mounted in ball and socket type joint enabling the interior end of the lever to describe a frustoconical zone of swivelling. Internal mechanism, including an electromagnetic cancellation mechanism, within the body bears against the interior end of the lever to define various operating positions for the lever around the zone of swivelling, each correlated with actuation of a particular one of the membrane switches by means of a transverse circular disc that is on the lever between the lever mounting and the interior end of the lever.

Abstract: In a "two-wire" multiplexed lighting system, a square wave voltage alternating between positive and negative polarities is delivered by the two wires to both right and left lamps. Each lamp includes a diode, and the diodes are oppositely pulled with respect to each other so that one of the lamps is energized by one polarity of the square wave while the other lamp is energized by the opposite polarity. The magnitude of each polarity relative to ground is twice the continuous D.C. voltage rating of each lamp so that the average voltage applied to each lamp can be equal to the load's maximum continuous rating to thereby provide full intensity illumination.

Abstract: A throttle body assembly wherein a pair of throttle blades are counter-rotatably mounted in the induction passage and define at their juxtaposition venturi sections whose size is variable in accordance with the degree of rotation of the throttle blades. The blades are peripherally sealed with respect to the walls of the induction passage by means of wiper type seals affixed to each blade as well as by caged roller type seals.