Patents by Inventor Donald E. Storjohann

Donald E. Storjohann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6660153
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Patent number: 6660154
    Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Patent number: 6531046
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: March 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, III, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
  • Publication number: 20020088713
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 11, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Publication number: 20020084193
    Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 4, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Publication number: 20020000382
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Application
    Filed: December 15, 2000
    Publication date: January 3, 2002
    Applicant: Shipley Company, L.L.C. of Marlborough
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
  • Patent number: 5484626
    Abstract: Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.
    Type: Grant
    Filed: April 6, 1992
    Date of Patent: January 16, 1996
    Assignee: Shipley Company L.L.C.
    Inventors: Donald E. Storjohann, Sven J. Wiberg