Patents by Inventor Donald Ferrier

Donald Ferrier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing a non-conductive substrate for electroplating
    Patent number: 5536386
    Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: July 16, 1996
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
  • Composition and method for selective plating
    Patent number: 5518760
    Abstract: This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.
    Type: Grant
    Filed: March 22, 1995
    Date of Patent: May 21, 1996
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson
  • Composition and method for selective plating
    Patent number: 5468515
    Abstract: This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: November 21, 1995
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson