Patents by Inventor Donald G. Hersey

Donald G. Hersey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB cavity mode suppression
    Patent number: 11317502
    Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: April 26, 2022
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
  • PCB CAVITY MODE SUPPRESSION
    Publication number: 20210360772
    Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 18, 2021
    Applicant: Raytheon Company
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
  • Method of wire bonding a first and second circuit card
    Patent number: 10999938
    Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: May 4, 2021
    Assignee: Raytheon Company
    Inventors: Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict