Patents by Inventor Donald G. Lockard

Donald G. Lockard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for wiping a metal contaminated surface with a water soluble fabric
    Patent number: 5762716
    Abstract: The invention provides methods for wiping metal contaminants from a surface, especially a circuit board assembly, or other surface exposed to solder paste, and solubilizing the wiping material. Metal contaminants are then easily and safely removed from the solubilized material for safe recycling and/or disposal.
    Type: Grant
    Filed: January 9, 1997
    Date of Patent: June 9, 1998
    Assignees: American Iron & Metal Company, Inc., La Compagnie Americanine de Fer et Metaux, Inc.
    Inventors: Donald G. Lockard, Karl S. Seelig
  • Lead-free and bismuth-free tin alloy solder composition
    Patent number: 5405577
    Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2% tin, 0.5-3.5% silver, 0.1-2.8% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-216.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.
    Type: Grant
    Filed: April 11, 1994
    Date of Patent: April 11, 1995
    Inventors: Karl F. Seelig, Donald G. Lockard
  • Lead-free bismuth free tin alloy solder composition
    Patent number: 5352407
    Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-215.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.
    Type: Grant
    Filed: April 29, 1993
    Date of Patent: October 4, 1994
    Inventors: Karl F. Seelig, Donald G. Lockard