Abstract: A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.

Abstract: A method for plating a metal from an electroless plating bath onto a substrate is provided which includes providing a source of an electroless plating bath at a non-plating temperature in a master mixing tank; transferring at least a portion of the plating bath to at least one plating cell, changing the bath temperature to a plating temperature, and contacting the substrate to be plated with the bath at a plating temperature.

Abstract: A high density electronic circuit module which includes a thin flexible film chip carrier having circuitry on both sides thereof. The double-sided thin, flexible circuitry is fabricated by depositing a first layer of chrome-copper-chrome circuitry on an aluminum substrate. This first layer of chrone-copper-chrome circuitry is covered with a layer of polyimide. Vias are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate carrier. It is noted that hydrochloric acid etches aluminum whereas it does not etch chrome-copper-chrome circuitry.

Abstract: A high density electronic circuit module which includes a thin flexible film chip carrier having circuitry on both sides thereof. The double-sided thin, flexible circuitry is fabricated by depositing a first layer of chrome-copper-chrome circuitry on an aluminum substrate. This first layer of chrome-copper-chrome circuitry is covered with a layer of polyimide. Vias are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate carrier. It is noted that hydrochloric acid etches aluminum whereas it does not etch chrome-copper-chrome circuitry.

Abstract: A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.

Abstract: A fluid is applied between the carrier member and the conductive member of a peel apart structure during the peel apart operation between the carrier member and the conductive member. The fluid reduces the bonding strength between the carrier member and the conductive member and thus maintains the integrity of the conductive member as the carrier member is peeled away.

Abstract: A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit (IC) chips with a high density (i.e. 100 or more) input/output I/O terminal array on the bottom surface of each chip bonded to a corresponding registerable array of PC conductor pads of the polyimide member. The forming, curing and circuitizing of the polyimide member, the bonding of the I/O terminals to the pads of the PC member, and the bonding of the pin heads to the PC member are done on a temporary support or fixture. The method provides a reliable manner for fabrication of the package assembly which minimizes the risk of destroying the flexibility of the PC member and/or its integrity during the making of the assembly and/or the subsequent thermal cycling associated with the assembly.