Abstract: In apparatus for repairing printed circuit lines or attaching electrical components, a pair of brazing electrodes and holder therefor in which the electrodes can be repetitively extended to compensate for wear without necessity of removal and machining heretofore required. The holder is a part of the circuit delivering electrical power to the electrodes and makes contact with the electrodes close to the working tip to maintain uniform circuit resistance and repairs of consistent quality.

Abstract: A method of fabricating a semiconductor device mounting element embodying a wire fan-out wherein the ends of a plurality of insulated wires are supported in a spatial parallel arrangement of columns and rows between two spaced apertured die elements, the spacing of the wires is reduced at a first location between the die elements while maintaining the spatial arrangement of columns and rows, forming an enclosure about the wire portions positioned adjacent one of the die elements and the location where the spacing of the wires is reduced, injecting an organic hardenable resin material into the enclosure thereby encapsulating the wires positioned within, severing the wires, and removing the die.