Patents by Inventor Donald H Hickel, Jr.

Donald H Hickel, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
    Patent number: 9511220
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: December 6, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Bruehl E. Truex, Donald H. Hickel, Jr.
  • ELEVATED HERMETIC FEEDTHROUGH INSULATOR ADAPTED FOR SIDE ATTACHMENT OF ELECTRICAL CONDUCTORS ON THE BODY FLUID SIDE OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE
    Publication number: 20150134039
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 14, 2015
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Bruehl E. Truex, Donald H. Hickel, JR.
  • Lid closer for injection mold
    Patent number: 8083978
    Abstract: Injection molded parts having bodies and lids connected by living hinges have the lids closed against the bodies during an opening sequence of mold plates. The lid closing mechanism is arranged in an intermediate plate disposed between a movable B plate and a fixed A plate. Movable and fixed cavities can meet within the intervening plate where a lid closer accomplishes lid closing as mold plates separate during mold opening. Accomplishing the lid closure during a mold opening sequence avoids any increase in the mold cycle time.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: December 27, 2011
    Assignee: Accede Mold & Tool, Inc.
    Inventors: Roger L Fox, Terrance A Fox, Donald H Hickel, Jr.