Patents by Inventor Donald H. Klosterman

Donald H. Klosterman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6093972
    Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12).
    Type: Grant
    Filed: May 3, 1999
    Date of Patent: July 25, 2000
    Assignee: Motorola, Inc.
    Inventors: Francis J. Carney, George Amos Carson, Phillip C. Celaya, Harry Fuerhaupter, Frank Tim Jones, Donald H. Klosterman, Cynthia M. Melton, James Howard Knapp, Keith E. Nelson
  • Patent number: 5895229
    Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12).
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: April 20, 1999
    Assignee: Motorola, Inc.
    Inventors: Francis J. Carney, George Amos Carson, Phillip C. Celaya, Harry Fuerhaupter, Frank Tim Jones, Donald H. Klosterman, Cynthia M. Melton, James Howard Knapp, Keith E. Nelson
  • Patent number: 5723229
    Abstract: A portable fuel cell device (10) includes a fuel reservoir (26) and an oxidant chamber (34). Gaseous fuel from the fuel reservoir (26) is mixed with an oxidant from the oxidant chamber (34) by an aspirator (42) to form a fuel-oxidant mixture. The fuel-oxidant mixture is passed through a fuel-oxidant line (44) into a fuel cell (13). The fuel cell (13) contains a reaction chamber (20) that generates electricity by reacting the fuel-oxidant mixture. Waste gaseous products, such as water and carbon dioxide, are sent through an exhaust line (24) to a water trap (46). The water trap (46) contains a water absorbing medium (52) for absorbing the water vapor from the exhaust gas, thereby forming a dry exhaust gas. The dry exhaust gas is released through the exhaust vent (48) into the ambient atmosphere.
    Type: Grant
    Filed: July 8, 1996
    Date of Patent: March 3, 1998
    Assignee: Motorola, Inc.
    Inventors: Steven Michael Scheifers, Donald H. Klosterman, Marc Kenneth Chason, Karl W. Wyatt
  • Patent number: 4787404
    Abstract: A low flow rate-low pressure atomizer device is disclosed which is so dimensioned and operated as to accelerate a gas to substantially sonic velocity and cause it to break up a cleaning liquid into small droplets and accelerate these droplets to at least half the velocity of said gas to create shear stress at a surface closely adjacent the exit end of said device, thereby to remove contaminants or the like from said surface.
    Type: Grant
    Filed: June 12, 1987
    Date of Patent: November 29, 1988
    Assignee: International Business Machines Corporation
    Inventors: Donald H. Klosterman, Sofia M. Laskowski, Scott V. Knee, Shei-Kung Shi