Abstract: An integrated circuit comprises a first substrate, an integrated circuit die attached to the first substrate, and a second substrate overlying at least a portion of the integrated circuit die. The second substrate comprises at least one conductor that is wire bonded to a conductor of the first substrate and electrically connected to a conductor of the integrated circuit die. In an illustrative embodiment, conductors of the second substrate are used to provide core power and ground connections for the integrated circuit die.

Abstract: An integrated circuit device comprising a die having a top surface with a peripheral region and an interior region surrounded by the peripheral region. Bond pads are disposed in the peripheral region of the die. One or more internal buses are disposed in the interior region of the die. The one or more internal buses distribute power to internal node points of the die. One or more bond wires connect one or more peripheral bond pads with one or more internal buses.